Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10189142 | Method for polishing a semiconductor wafer | Klaus Roettger, Leszek Mistur, Makoto Tabata, Vladimir Dutschke, Torsten Olbrich | 2019-01-29 |
| 9221149 | Method for polishing semiconductor wafers by means of simultaneous double-side polishing | Rainer Baumann, Johannes Staudhammer, Leszek Mistur, Klaus Roettger | 2015-12-29 |
| 8242020 | Method for producing a semiconductor wafer | Klaus Roettger, Gerhard Heier | 2012-08-14 |
| 7766724 | Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafers | Anton Huber, Clemens Radspieler, Helmut Seehofer | 2010-08-03 |
| 7108583 | Method for removing material from a semiconductor wafer | Robert Drexler, Anton Huber, Robert Weiss | 2006-09-19 |
| 6861360 | Double-sided polishing process for producing a multiplicity of silicon semiconductor wafers | Guido Wenski, Thomas Altmann, Anton Huber | 2005-03-01 |