Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9296087 | Method for conditioning polishing pads for the simultaneous double-side polishing of semiconductor wafers | — | 2016-03-29 |
| 9221149 | Method for polishing semiconductor wafers by means of simultaneous double-side polishing | Rainer Baumann, Alexander Heilmaier, Leszek Mistur, Klaus Roettger | 2015-12-29 |