Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10707069 | Method for polishing a semiconductor wafer | Michael Kerstan | 2020-07-07 |
| 9533394 | Method for the local polishing of a semiconductor wafer | — | 2017-01-03 |
| 9308619 | Method for the double-side polishing of a semiconductor wafer | — | 2016-04-12 |
| 9224613 | Method for polishing both sides of a semiconductor wafer | — | 2015-12-29 |
| 9193026 | Method for polishing a semiconductor material wafer | — | 2015-11-24 |
| 8882565 | Method for polishing a semiconductor wafer | Roland Koppert | 2014-11-11 |
| 8721390 | Method for the double-side polishing of a semiconductor wafer | Thomas Buschhardt, Roland Koppert | 2014-05-13 |
| 8685270 | Method for producing a semiconductor wafer | Thomas Buschhardt, Diego Feijoo, Michael Kerstan, Georg Pietsch, Guenter Schwab | 2014-04-01 |
| 8647985 | Method for polishing a substrate composed of semiconductor material | Thomas Buschhardt, Roland Koppert, Georg Pietsch | 2014-02-11 |
| 8647173 | Method for polishing a semiconductor wafer | Thomas Buschhardt, Roland Koppert | 2014-02-11 |
| 8551870 | Method for producing an epitaxially coated semiconductor wafer | Roland Koppert | 2013-10-08 |
| 8529315 | Method for producing a semiconductor wafer | Michael Kerstan | 2013-09-10 |
| 8500516 | Method for polishing a semiconductor wafer | — | 2013-08-06 |
| 8501028 | Method for grinding a semiconductor wafer | — | 2013-08-06 |
| 8444455 | Polishing pad and method for polishing a semiconductor wafer | Roland Koppert | 2013-05-21 |
| 8389409 | Method for producing a semiconductor wafer | — | 2013-03-05 |
| 8388411 | Method for polishing the edge of a semiconductor wafer | — | 2013-03-05 |
| 8376810 | Method for chemically grinding a semiconductor wafer on both sides | — | 2013-02-19 |
| 8376811 | Method for the double sided polishing of a semiconductor wafer | — | 2013-02-19 |
| 8343873 | Method for producing a semiconductor wafer | — | 2013-01-01 |
| 8338302 | Method for polishing a semiconductor wafer with a strained-relaxed Si1−xGex layer | Roland Koppert | 2012-12-25 |