Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811378 | Electronic package and manufacturing method thereof | — | 2020-10-20 |
| 10643974 | Electronic package with conductive pillars | Chia-Yang Chen, Chih-Chiang He | 2020-05-05 |
| 10587037 | Electronic package structure | Heng-Cheng Chu, Chien-Cheng Lin, Tsung-Hsien Tsai, Chao-Ya Yang, Yude Chu | 2020-03-10 |
| 10587041 | Electronic package structure and fabrication method thereof | Chih-Yuan Shih, Yueh-Chiung Chang, Tsung Li Lin, Chi-Pin Tsai, Chien-Cheng Lin +3 more | 2020-03-10 |
| 10573623 | Electronic package structure with multiple electronic components | — | 2020-02-25 |
| 10461041 | Electronic package and method for fabricating the same | Chia-Yang Chen | 2019-10-29 |
| 10410970 | Electronic package and method for fabricating the same | Chia-Yang Chen | 2019-09-10 |
| 10230152 | Electronic package and fabrication method thereof | Heng-Cheng Chu, Chien-Cheng Lin, Tsung-Hsien Tsai, Chao-Ya Yang | 2019-03-12 |
| 10199317 | Electronic package | Chia-Yang Chen, Ying-Wei Lu, Jyun-Yuan Jhang, Ming-Fan Tsai | 2019-02-05 |
| 10199731 | Electronic component | Heng-Cheng Chu, Cheng-Yu Chiang | 2019-02-05 |
| 10074621 | Electronic package with antenna structure | Chi-Pin Tsai, Chi-Liang Shih, Ming-Fan Tsai, Chia-Yang Chen | 2018-09-11 |
| 10074613 | Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages | Hao-Ju Fang, Hsin-Lung Chung, Cho-Hsin Chang, Tsung-Hsien Tsai, Chia-Yang Chen +1 more | 2018-09-11 |
| 10062582 | Fabrication method of package having ESD and EMI preventing functions | Tsung-Hsien Tsai, Hsin-Lung Chung, Chien-Cheng Lin | 2018-08-28 |
| 9997477 | Method of manufacturing semiconductor package | Tsung-Hsien Tsai, Heng-Cheng Chu, Chien-Cheng Lin, Hsin-Lung Chung, Yude Chu | 2018-06-12 |
| 9999132 | Electronic package | Chia-Yang Chen, Ying-Wei Lu, Jyun-Yuan Jhang, Ming-Fan Tsai | 2018-06-12 |
| 9907186 | Electronic package structure and method for fabricating the same | Chen-Wen Huang, Hsin-Lung Chung, Wen-Jung Tsai, Jia-Huei Hung, Fu-Tang Huang | 2018-02-27 |
| 9899335 | Method for fabricating package structure | Hsin-Lung Chung, Cho-Hsin Chang, Chia-Yang Chen, Chao-Ya Yang | 2018-02-20 |
| 9673151 | Semiconductor package having metal layer | Hao-Ju Fang, Hsin-Lung Chung, Cho-Hsin Chang, Tsung-Hsien Tsai, Chia-Yang Chen +1 more | 2017-06-06 |
| 9627748 | Electronic component | Heng-Cheng Chu, Cheng-Yu Chiang | 2017-04-18 |
| 9508656 | Package structure and method for fabricating the same | Hsin-Lung Chung, Cho-Hsin Chang, Chia-Yang Chen, Chao-Ya Yang | 2016-11-29 |
| 9502758 | Electronic package and fabrication method thereof | Hsin-Lung Chung, Hao-Ju Fang, Yude Chu, Tsung-Hsien Tsai | 2016-11-22 |
| 9502377 | Semiconductor package and fabrication method thereof | Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen, Chih-Ming Cheng, Yude Chu | 2016-11-22 |
| 9337250 | Semiconductor package and method of manufacturing the same | Tsung-Hsien Tsai, Heng-Cheng Chu, Chien-Cheng Lin, Hsin-Lung Chung, Yude Chu | 2016-05-10 |
| 9221873 | Short-chain peptide capable of controlling spermatozoa fertilization performance | Meng-Chieh Hsu | 2015-12-29 |
| 9111945 | Package having ESD and EMI preventing functions and fabrication method thereof | Tsung-Hsien Tsai, Hsin-Lung Chung, Chien-Cheng Lin | 2015-08-18 |