Issued Patents All Time
Showing 76–100 of 127 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7573135 | Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film | Masahiro Sunohara, Mitsutoshi Higashi, Toshinori Koyama | 2009-08-11 |
| 7563987 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Hiroyuki Kato, Syoji Watanabe | 2009-07-21 |
| 7557450 | Wiring substrate and electronic parts packaging structure | Masahiro Sunohara | 2009-07-07 |
| 7545049 | Electronic parts packaging structure | Masahiro Sunohara, Toshinori Koyama, Kazutaka Kobayashi, Mitsutoshi Higashi | 2009-06-09 |
| 7530163 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Naohiro Mashino, Mitsutoshi Higashi | 2009-05-12 |
| 7524025 | Inkjet printer | — | 2009-04-28 |
| 7508057 | Electronic component device | Akinori Shiraishi, Yuichi Taguchi, Masahiro Sunohara, Mitsutoshi Higashi | 2009-03-24 |
| 7498200 | Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film | Masahiro Sunohara, Mitsutoshi Higashi, Toshinori Koyama | 2009-03-03 |
| 7494898 | Method for manufacturing semiconductor device | Masahiro Sunohara, Yuichi Taguchi, Akinori Shiraishi, Naoyuki Koizumi, Hideaki Sakaguchi +1 more | 2009-02-24 |
| 7488094 | Semiconductor device and manufacturing method of semiconductor device | Akinori Shiraishi, Masahiro Sunohara, Naoyuki Koizumi, Hideaki Sakaguchi, Mitsutoshi Higashi +1 more | 2009-02-10 |
| 7470891 | Optical device | Naoyuki Koizumi, Masahiro Sunohara, Akinori Shiraishi, Yuichi Taguchi, Hideaki Sakaguchi +1 more | 2008-12-30 |
| 7420128 | Electronic component embedded substrate and method for manufacturing the same | Masahiro Sunohara, Mitsutoshi Higashi, Hiroyuki Kato | 2008-09-02 |
| 7330037 | Electrical characteristic measuring probe and method of manufacturing the same | Naoyuki Koizumi, Akinori Shiraishi | 2008-02-12 |
| 7285728 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Hiroyuki Kato, Syoji Watanabe | 2007-10-23 |
| 7285862 | Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film | Masahiro Sunohara, Mitsutoshi Higashi, Toshinori Koyama | 2007-10-23 |
| 7279771 | Wiring board mounting a capacitor | Masahiro Sunohara, Mitsutoshi Higashi, Toshio Gomyo, Yukiharu Takeuchi | 2007-10-09 |
| 7251391 | Optical waveguide mounting member, substrate, semiconductor device, method of manufacturing optical waveguide mounting member, and method of manufacturing substrate | — | 2007-07-31 |
| 7221816 | Substrate, semiconductor device, method of manufacturing substrate, and method of manufacturing semiconductor device | — | 2007-05-22 |
| 7217888 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Naohiro Mashino, Mitsutoshi Higashi | 2007-05-15 |
| 7183647 | Wiring substrate and electronic parts packaging structure | Masahiro Sunohara | 2007-02-27 |
| 7134195 | Method of production of multilayer circuit board with built-in semiconductor chip | Masahiro Sunohara, Mitsutoshi Higashi | 2006-11-14 |
| 7084009 | Method of manufacturing a packaging structure for electronic parts buried in an insulating film formed on the electronic parts and a wiring substrate | Masahiro Sunohara, Naohiro Mashino, Mitsutoshi Higashi | 2006-08-01 |
| 7084006 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Mitsutoshi Higashi | 2006-08-01 |
| 7067353 | Method for manufacturing semiconductor package having electrodes penetrating through semiconductor wafer | Naoyuki Koizumi, Takashi Kurihara, Mitsutoshi Higashi | 2006-06-27 |
| 7061261 | Semiconductor inspection device and method for manufacturing contact probe | — | 2006-06-13 |