KM

Kei Murayama

SC Shinko Electric Industries Co.: 120 patents #2 of 723Top 1%
PA Panasonic: 4 patents #6,180 of 21,108Top 30%
AM Asahi Kasei Microdevices: 1 patents #116 of 231Top 55%
TO Tosoh: 1 patents #576 of 1,042Top 60%
SO Sony: 1 patents #17,262 of 25,231Top 70%
Overall (All Time): #8,828 of 4,157,543Top 1%
127
Patents All Time

Issued Patents All Time

Showing 26–50 of 127 patents

Patent #TitleCo-InventorsDate
8350390 Wiring substrate and semiconductor device Masahiro Sunohara, Akinori Shiraishi, Hideaki Sakaguchi 2013-01-08
8338289 Method of manufacturing a semiconductor chip including a semiconductor substrate and a through via provided in a through hole Mitsutoshi Higashi 2012-12-25
8330050 Wiring board having heat intercepting member Hideaki Sakaguchi 2012-12-11
8227909 Semiconductor package and method of manufacturing the same Hideaki Sakaguchi, Mitsutoshi Higashi, Yuichi Taguchi, Akinori Shiraishi 2012-07-24
8221997 Microorganism and method for producing carotenoid using the same Toru Tanaka, Teruhiko Ide, Seigou Oe, Toru Imaizumi, Satoshi Hanzawa +1 more 2012-07-17
8183469 Wiring board and method of manufacturing the same Masahiro Sunohara, Takaharu Yamano 2012-05-22
8178957 Electronic component device, and method of manufacturing the same Yuichi Taguchi, Akinori Shiraishi, Mitsutoshi Higashi 2012-05-15
8169073 Semiconductor device and electronic apparatus of multi-chip packaging Mitsutoshi Higashi 2012-05-01
8148738 Semiconductor device having an element mounted on a substrate and an electrical component connected to the element Mitsutoshi Higashi, Naoyuki Koizumi, Yuichi Taguchi, Akinori Shiraishi, Masahiro Sunohara 2012-04-03
8137497 Method of manufacturing wiring substrate Masahiro Sunohara, Mitsutoshi Higashi, Hideaki Sakaguchi 2012-03-20
8129830 Electronic component package and method of manufacturing the same, and electronic component device 2012-03-06
8111523 Wiring board with switching function and method of manufacturing the same Masahiro Sunohara 2012-02-07
8108993 Method of manufacturing wiring substrate, and method of manufacturing semiconductor device Mitsutoshi Higashi, Masahiro Sunohara, Hideaki Sakaguchi 2012-02-07
8106484 Silicon substrate for package Akinori Shiraishi, Yuichi Taguchi, Masahiro Sunohara, Mitsutoshi Higashi 2012-01-31
8100555 Lighting apparatus Mitsutoshi Higashii, Yuichi Taguchi, Masahiro Sunohara, Akinori Shiraishi 2012-01-24
8080122 Method of manufacturing wiring substrate and method of manufacturing semiconductor device Masahiro Sunohara, Mitsutoshi Higashi, Hideaki Sakaguchi 2011-12-20
8046911 Method for mounting electronic component on substrate and method for forming solder surface 2011-11-01
8044429 Light-emitting device and method for manufacturing the same Mitsutoshi Higashi, Masahiro Sunohara, Yuichi Taguchi, Akinori Shiraishi, Naoyuki Koizumi +1 more 2011-10-25
8026610 Silicon interposer and method for manufacturing the same 2011-09-27
8026576 Wiring board Shinji Nakajima 2011-09-27
8022872 Positioning receiver Hiroshi Katayama, Akifumi Miyano, Hirofumi Yoshida, Kazuhiro Nojima 2011-09-20
8003895 Electronic parts packaging structure and method of manufacturing the same Masahiro Sunohara, Hiroyuki Kato, Syoji Watanabe 2011-08-23
7989927 Silicon substrate for package Akinori Shiraishi, Yuichi Taguchi, Masahiro Sunohara, Mitsutoshi Higashi 2011-08-02
7981798 Method of manufacturing substrate Yuichi Taguchi, Akinori Shiraishi, Masahiro Sunohara, Hideaki Sakaguchi, Mitsutoshi Higashi 2011-07-19
7964950 Electronic parts packaging structure and method of manufacturing the same Masahiro Sunohara, Toshinori Koyama, Kazutaka Kobayashi, Mitsutoshi Higashi 2011-06-21