Issued Patents All Time
Showing 101–125 of 127 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7057290 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Toshinori Koyama, Kazutaka Kobayashi, Mitsutoshi Higashi | 2006-06-06 |
| 6974721 | Method for manufacturing thin semiconductor chip | Naoyuki Koizumi, Shigeru Mizuno, Takashi Kurihara | 2005-12-13 |
| 6958298 | Method for thinning wafer by grinding | — | 2005-10-25 |
| 6943442 | Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film | Masahiro Sunohara, Naohiro Mashino, Mitsutoshi Higashi | 2005-09-13 |
| 6930392 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Mitsutoshi Higashi | 2005-08-16 |
| 6864120 | Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion | Mitsutoshi Higashi, Hideaki Sakaguchi, Hiroko Koike | 2005-03-08 |
| 6861284 | Semiconductor device and production method thereof | Mitsutoshi Higashi, Hideaki Sakaguchi, Hiroko Koike | 2005-03-01 |
| 6835597 | Semiconductor package | — | 2004-12-28 |
| 6831000 | Semiconductor device manufacturing method | — | 2004-12-14 |
| 6803664 | Semiconductor package | — | 2004-10-12 |
| 6797603 | Semiconductor device and method of production of same | Mitsutoshi Higashi | 2004-09-28 |
| 6738504 | Inspection apparatus for semiconductor device and parts mounter using same | Mitsutoshi Higashi | 2004-05-18 |
| 6713863 | Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion | Mitsutoshi Higashi, Hideaki Sakaguchi, Hiroko Koike | 2004-03-30 |
| 6548326 | Semiconductor device and process of producing same | Tsuyoshi Kobayashi, Mitsutoshi Higashi, Hiroko Koike, Hideaki Sakaguchi | 2003-04-15 |
| 6538332 | Semiconductor device and method of production of same | Mitsutoshi Higashi | 2003-03-25 |
| 6522022 | Mounting structure for semiconductor devices | — | 2003-02-18 |
| 6522719 | Method and apparatus for measuring a bump on a substrate | Mitsutoshi Higashi | 2003-02-18 |
| 6420787 | Semiconductor device and process of producing same | Tsuyoshi Kobayashi, Mitsutoshi Higashi, Hiroko Koike, Hideaki Sakaguchi | 2002-07-16 |
| 6404070 | Semiconductor device | Mitsutoshi Higashi, Hideaki Sakaguchi, Hiroko Koike | 2002-06-11 |
| 6344695 | Semiconductor device to be mounted on main circuit board and process for manufacturing same device | — | 2002-02-05 |
| 6312551 | Method for mounting semiconductor chip onto circuit board | Mitsutoshi Higashi | 2001-11-06 |
| 6303998 | Semiconductor device having a chip mounted on a rectangular substrate | — | 2001-10-16 |
| 6281592 | Package structure for semiconductor chip | — | 2001-08-28 |
| 6281567 | Substrate for mounting semiconductor chip with parallel conductive lines | Mitsutoshi Higashi | 2001-08-28 |
| 6081038 | Semiconductor chip package structure | — | 2000-06-27 |