Issued Patents All Time
Showing 51–68 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8981580 | Bond pad structure | Shin-Puu Jeng, Hao-Yi Tsai, Hsien-Wei Chen | 2015-03-17 |
| 8907478 | Bump pad structure | Hao-Yi Tsai, Hsien-Wei Chen, Ying-Ju Chen, Hsiu-Ping Wei | 2014-12-09 |
| 8860208 | Heat spreader structures in scribe lines | Hsien-Wei Chen, Jyh-Cherng Sheu, Hao-Yi Tsai, Shin-Puu Jeng, Chen-Hua Yu +1 more | 2014-10-14 |
| 8836084 | Structure for reducing integrated circuit corner peeling | Hsien-Wei Chen, Hao-Yi Tsai | 2014-09-16 |
| 8810025 | Reinforcement structure for flip-chip packaging | Ching-Jung Yang, Hsien-Wei Chen, Hsin-Yu Pan, Chao-Wen Shih | 2014-08-19 |
| 8722529 | Double solid metal pad with reduced area | Hsien-Wei Chen, Hao-Yi Tsai, Shin-Puu Jeng, Ying-Ju Chen | 2014-05-13 |
| 8648444 | Wafer scribe line structure for improving IC reliability | Hsien-Wei Chen, Hao-Yi Tsai, Shin-Puu Jeng | 2014-02-11 |
| 8581423 | Double solid metal pad with reduced area | Hsien-Wei Chen, Hao-Yi Tsai, Shin-Puu Jeng, Ying-Ju Chen | 2013-11-12 |
| 8450126 | Semiconductor test pad structures | Hsien-Wei Chen, Ying-Ju Chen, Hao-Yi Tsai, Shin-Puu Jeng | 2013-05-28 |
| 8405211 | Bump pad structure | Hao-Yi Tsai, Hsien-Wei Chen, Ying-Ju Chen, Hsiu-Ping Wei | 2013-03-26 |
| 8373254 | Structure for reducing integrated circuit corner peeling | Hsien-Wei Chen, Hao-Yi Tsai | 2013-02-12 |
| 8334582 | Protective seal ring for preventing die-saw induced stress | Shin-Puu Jeng, Hsien-Wei Chen, Shang-Yun Hou, Hao-Yi Tsai, Anbiarshy Wu | 2012-12-18 |
| 8278737 | Structure for improving die saw quality | Hsien-Wei Chen, Hao-Yi Tsai, Ying-Ju Chen, Shin-Puu Jeng | 2012-10-02 |
| 8227916 | Package structure and method for reducing dielectric layer delamination | Hsiu-Ping Wei, Shin-Puu Jeng, Hao-Yi Tsai, Hsien-Wei Chen, Ying-Ju Chen +1 more | 2012-07-24 |
| 8178980 | Bond pad structure | Shin-Puu Jeng, Hao-Yi Tsai, Hsien-Wei Chen | 2012-05-15 |
| 8013333 | Semiconductor test pad structures | Hsien-Wei Chen, Ying-Ju Chen, Hao-Yi Tsai, Shin-Puu Jeng | 2011-09-06 |
| 7936067 | Backend interconnect scheme with middle dielectric layer having improved strength | Hao-Yi Tsai, Hsien-Wei Chen, Ying-Ju Chen, Shin-Puu Jeng | 2011-05-03 |
| 7906836 | Heat spreader structures in scribe lines | Hsien-Wei Chen, Jyh-Cherng Sheu, Hao-Yi Tsai, Shin-Puu Jeng, Chen-Hua Yu +1 more | 2011-03-15 |