Issued Patents All Time
Showing 26–50 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D953623 | Electronic atomizing apparatus assembly | You Shi, Baosheng Lai | 2022-05-31 |
| D951534 | Atomizer for an electronic cigarette | You Shi | 2022-05-10 |
| 11330728 | Handle extension structure and electronic device casing | Long Ye, Yao-Hsien Huang | 2022-05-10 |
| D950838 | Electronic atomizing device | You Shi | 2022-05-03 |
| D943183 | Atomizing device | Baosheng Lai | 2022-02-08 |
| D943154 | Atomizing device | Baosheng Lai | 2022-02-08 |
| D942069 | Atomizer | You Shi | 2022-01-25 |
| D939762 | Electronic atomizing assembly | Zhanhui Sun, Baosheng Lai | 2021-12-28 |
| D934490 | Atomizer | You Shi | 2021-10-26 |
| D932093 | Electronic atomizing device | You Shi, Baosheng Lai | 2021-09-28 |
| D929035 | Power supply device for electronic atomizing device | Jinghong Chen, Zhanhui Sun | 2021-08-24 |
| D928397 | Electronic atomizing device | You Shi | 2021-08-17 |
| D924477 | Electronic atomizing device assembly | Zhanhui Sun, Yuehan Li | 2021-07-06 |
| D923867 | Atomizer for an electronic cigarette | You Shi | 2021-06-29 |
| D916360 | Electronic cigarette | — | 2021-04-13 |
| D911599 | Power supply device for electronic cigarette | Zhanhui Sun | 2021-02-23 |
| D910234 | Power supply device for electronic cigarette | Zhanhui Sun | 2021-02-09 |
| D883567 | Atomizer for electronic cigarette | — | 2020-05-05 |
| 10224238 | Electrical components having metal traces with protected sidewalls | Chang-Ming Lu, Chia-Yu Chen, Chih-Pang Chang, Ching-Sang Chuang, Hung-Che Ting +12 more | 2019-03-05 |
| 9859235 | Underbump metallization structure | Hao-Yi Tsai, Hsien-Wei Chen, Shin-Puu Jeng, Ying-Ju Chen, Shang-Yun Hou +2 more | 2018-01-02 |
| 9646954 | Integrated circuit with test circuit | Shih-Wei Liang, Hsien-Wei Chen | 2017-05-09 |
| 9601446 | Method of fabricating a bond pad structure | Shin-Puu Jeng, Hsien-Wei Chen, Hao-Yi Tsai | 2017-03-21 |
| 9536847 | Bump pad structure | Hsiu-Ping Wei, Hsien-Wei Chen, Hao-Yi Tsai, Ying-Ju Chen | 2017-01-03 |
| 9171811 | Bump pad structure | Hao-Yi Tsai, Hsien-Wei Chen, Ying-Ju Chen, Hsiu-Ping Wei | 2015-10-27 |
| 9117831 | Seal ring structure for integrated circuit chips | Ching-Jung Yang, Michael Shou-Ming Tong, Hsien-Wei Chen, Chung-Ying Yang, Tsung-Yuan Yu | 2015-08-25 |