Issued Patents All Time
Showing 201–225 of 226 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7948555 | Camera module and electronic apparatus having the same | Un-Byoung Kang, Chung-Sun Lee, Woon-Seong Kwon, Hyung-Sun Jang | 2011-05-24 |
| 7895742 | Method for manufacturing tape wiring board | Kyoung-Sei Choi, Sa-Yoon Kang, Chung-Sun Lee | 2011-03-01 |
| 7893514 | Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package | Woon-Seong Kwon, Un-Byoung Kang, Chung-Sun Lee, Hyung-Sun Jang | 2011-02-22 |
| 7884392 | Image sensor having through via | Hyuek Jae Lee, Tae-Je Cho, Un-Byoung Kang, Chung-Sun Lee, Woon-Seong Kwon +1 more | 2011-02-08 |
| 7786581 | Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device | Un-Byoung Kang, Chung-Sun Lee, Woon-Seong Kwon, Hyung-Sun Jang | 2010-08-31 |
| 7701513 | Video processing apparatus | — | 2010-04-20 |
| 7619315 | Stack type semiconductor chip package having different type of chips and fabrication method thereof | Woon-Seong Kwon, Un-Byoung Kang, Chung-Sun Lee, Hyung-Sun Jang | 2009-11-17 |
| 7569423 | Wafer-level-chip-scale package and method of fabrication | Chung-Sun Lee, Woon-byung Kang | 2009-08-04 |
| 7554201 | Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same | Uu-Byung Kang, Jong Ho Lee, Chung-Sun Lee | 2009-06-30 |
| 7359588 | Electroabsorption modulator and method of manufacturing the same | Young Shik Kang, Jeha Kim, Yong-Duck CHUNG | 2008-04-15 |
| 7331723 | Enhanced coplanar waveguide and optical communication module using the same | Ho Gyeong Yoon, Kwang-Seong Choi, Joong-Seon Choe | 2008-02-19 |
| 7324258 | Semiconductor optical modulator integrated resistor for impedance matching using semiconductor doped layer and method of fabricating the same | Joong-Seon Choe | 2008-01-29 |
| 7299547 | Method for manufacturing tape wiring board | Kyoung-Sei Choi, Sa-Yoon Kang, Chung-Sun Lee | 2007-11-27 |
| 7190073 | Circuit film with bump, film package using the same, and related fabrication methods | Sa-Yoon Kang, Chung-Sun Lee, Kyoung-Sei Choi | 2007-03-13 |
| 7115483 | Stacked chip package having upper chip provided with trenches and method of manufacturing the same | Se-Yong Oh, Sa-Yoon Kang | 2006-10-03 |
| 7078331 | Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same | Sa-Yoon Kang, Chung-Sun Lee | 2006-07-18 |
| 7074704 | Bump formed on semiconductor device chip and method for manufacturing the bump | Sa-Yoon Kang | 2006-07-11 |
| 7005687 | Photodetector | Joong-Seon Choe | 2006-02-28 |
| 6818998 | Stacked chip package having upper chip provided with trenches and method of manufacturing the same | Se-Yong Oh, Sa-Yoon Kang | 2004-11-16 |
| 6607938 | Wafer level stack chip package and method for manufacturing same | Sa-Yoon Kang, Dong-Hyeon Jang, Min Kyo Cho, Gu-Sung Kim | 2003-08-19 |
| 6555921 | Semiconductor package | Sa-Yoon Kang, Nam-Seog Kim, Dong-Hyeon Jang | 2003-04-29 |
| 6476494 | Silver-tin alloy solder bumps | Nam-jung Hur, Jong-Han Park | 2002-11-05 |
| 6407459 | Chip scale package | Sa-Yoon Kang | 2002-06-18 |
| 6376279 | method for manufacturing a semiconductor package | Sa-Yoon Kang, Nam-Seog Kim, Dong-Hyeon Jang | 2002-04-23 |
| 6235552 | Chip scale package and method for manufacturing the same using a redistribution substrate | Sa-Yoon Kang | 2001-05-22 |