Issued Patents All Time
Showing 51–75 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9554466 | Printed circuit board and method of manufacturing the same | Young Gwan Ko, Sang Hoon Kim, Kang Wook Bong, Hye Won Jung, Yong Wan Ji | 2017-01-24 |
| 9420709 | Coreless board for semiconductor package, method of manufacturing the same, and method of manufacturing semiconductor package using the same | Young Kwan Lee, Joo Hwan Jung, Ju-hee Park, Seung Yeop Kook | 2016-08-16 |
| 9021690 | Method of manufacturing printed circuit board having buried solder bump | — | 2015-05-05 |
| 8945993 | Method of manufacturing a ball grid array substrate or a semiconductor chip package | Jung-Hyun Park, Nam Keun Oh, Sang-Duck Kim, Jong-Gyu Choi, Young Ji KIM +1 more | 2015-02-03 |
| 8881381 | Method of manufacturing printed circuit board | Mi Sun Hwang, Ok Tae Kim, Seon Ha Kang, Gil Yong Shin, Kil Yong Yun +1 more | 2014-11-11 |
| 8720048 | Method of manufacturing a printed circuit board | Mi Sun Hwang, Jae Joon Lee | 2014-05-13 |
| 8677618 | Method of manufacturing substrate using a carrier | Ki Hwan Kim, Jin Yong An | 2014-03-25 |
| 8633392 | Circuit board with high-density circuit patterns | Shuhichi Okabe, Jung-Hyun Park, Hoe-Ku Jung, Jeong Woo Park, Ji Eun Kim | 2014-01-21 |
| 8546943 | Ball grid array substrate with insulating layer and semiconductor chip package | Jung-Hyun Park, Nam Keun Oh, Sang-Duck Kim, Jong-Gyu Choi, Young Ji KIM +1 more | 2013-10-01 |
| 8541096 | Printed circuit board and method of manufacturing the same | Mi Sun Hwang, Jae Joon Lee | 2013-09-24 |
| 8464423 | Method of manufacturing a printed circuit board having metal bumps | Jeong Woo Park, Ok Tae Kim, Kil Yong Yun | 2013-06-18 |
| 8415200 | Method for manufacturing semiconductor package | Mi Sun Hwang, Keung Jin Sohn, Eung-Suek Lee | 2013-04-09 |
| 8298447 | Conductive paste, printed circuit board, and manufacturing method thereof | Ki Hwan Kim, Jee-Soo Mok | 2012-10-30 |
| 8256112 | Method of manufacturing high density printed circuit board | — | 2012-09-04 |
| 8197702 | Manufacturing method of printed circuit board | Jung-Hyun Park, Ji Eun Kim | 2012-06-12 |
| 8187479 | Manufacturing method of printed circuit board | — | 2012-05-29 |
| 8141241 | Method of manufacturing a printed circuit board having metal bumps | Jeong Woo Park, Ok Tae Kim, Kil Yong Yun | 2012-03-27 |
| 8124880 | Circuit board and method for manufacturing thereof | Shuhichi Okabe, Jung-Hyun Park, Hoe-Ku Jung, Jeong Woo Park, Ji Eun Kim | 2012-02-28 |
| 8080741 | Printed circuit board | Chin-Kwan Kim | 2011-12-20 |
| 8039762 | Printed circuit board having a buried solder bump and a circuit layer flush with an insulating layer | — | 2011-10-18 |
| 8022311 | Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same | Tae Eui Kim, Byoung-Youl Min, Je-Gwang Yoo | 2011-09-20 |
| 8022553 | Mounting substrate and manufacturing method thereof | Jin-yong Ahn, Chang-Sup Ryu, Byung-Youl Min | 2011-09-20 |
| 8003439 | Board on chip package and manufacturing method thereof | Chang-Sup Ryu, Jung-Hyun Park, Hoe-Ku Jung, Ji Eun Kim | 2011-08-23 |
| 7992291 | Method of manufacturing a circuit board | Hoe-Ku Jung, Je-Gwang Yoo, Ji Eun Kim, Jeong Woo Park, Jung-Hyun Park | 2011-08-09 |
| 7972460 | Method of manufacturing printed circuit board | Jung-Hyun Park, Jeong Woo Park, Ji Eun Kim | 2011-07-05 |