Issued Patents All Time
Showing 51–71 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7847416 | Wafer level package and method of fabricating the same | Hyun-Soo Chung, Son-Kwan Hwang, Dong-Ho Lee, Seong-Deok Hwang | 2010-12-07 |
| 7830017 | Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package | Dong-Ho Lee, Nam-Seog Kim, Hyun-Soo Chung, Ho-Jin Lee, Myeong-Soo Park | 2010-11-09 |
| 7777345 | Semiconductor device having through electrode and method of fabricating the same | Ho-Jin Lee, Nam-Seog Kim, Yong-Chai Kwon, Hyun-Soo Chung, Son-Kwan Hwang | 2010-08-17 |
| 7768206 | Plasma display panel | — | 2010-08-03 |
| 7741922 | Switch, negative resistance cell, and differential voltage controlled oscillator using the same | Seok Ju YUN, Sang-Gug Lee, Seong Hoon Choi, Chang Sun Kim | 2010-06-22 |
| 7732319 | Interconnection structure of integrated circuit chip | Se-Young Jeong, Sung-Min Sim, Soon-Bum Kim, Young-Hee Song | 2010-06-08 |
| 7602047 | Semiconductor device having through vias | Yong-Chai Kwon, Dong-Ho Lee | 2009-10-13 |
| 7592283 | Method of regenerating honeycomb type SCR catalyst by air lift loop reactor | Jung Bin Lee, Tae Won Lee, Kwang Chul Song | 2009-09-22 |
| 7592709 | Board on chip package and method of manufacturing the same | Hyun-Soo Chung, Dong-Hyeon Jang, Dong-Ho Lee | 2009-09-22 |
| 7545027 | Wafer level package having redistribution interconnection layer and method of forming the same | Hyun-Soo Chung, Dong-Hyeon Jang, Myeong-Soon Park, Dong-Ho Lee | 2009-06-09 |
| 7312143 | Wafer level chip scale package having a gap and method for manufacturing the same | Myeong-Soon Park, Hyun-Soo Chung, Jae-Sik Chung, Sung-Min Sim, Dong-Hyeon Jang +2 more | 2007-12-25 |
| 7307342 | Interconnection structure of integrated circuit chip | Se-Young Jeong, Sung-Min Sim, Soon-Bum Kim, Young-Hee Song | 2007-12-11 |
| 7271084 | Reinforced solder bump structure and method for forming a reinforced solder bump | Se-Young Jeong, Nam-Seog Kim, Oh-se Yong, Soon-Bum Kim, Sun Young Park +1 more | 2007-09-18 |
| 7205660 | Wafer level chip scale package having a gap and method for manufacturing the same | Myeong-Soon Park, Hyun-Soo Chung, Jae-Sik Chung, Sung-Min Sim, Dong-Hyeon Jang +2 more | 2007-04-17 |
| 7015590 | Reinforced solder bump structure and method for forming a reinforced solder bump | Se-Young Jeong, Nam-Seog Kim, Oh-se Yong, Soon-Bum Kim, Sun Young Park +1 more | 2006-03-21 |
| 6616754 | Segregation reducing agent consisting of curdlan and alkaline solution and hydraulic composition containing the segregation reducing agent | Young-Hoon Park, Jung Heon Lee, Mi-Kyoung Kim, Kyung-hee JUNG | 2003-09-09 |
| 6504450 | Signal process apparatus for phase-shifting N number of signals inputted thereto | Duk-Yong Kim, Yoon-Bae Lee, Gyu-Sang Hwang, Sang-Wook Bang, Chang-Yun Seo +4 more | 2003-01-07 |
| 6457659 | Roller press grinding plant | Jian Yang | 2002-10-01 |
| 6380128 | V2O5-based catalyst for removing NOx from flue gas and preparing method therefor | Pyung Sam Ji, Hee Eum, Jung Bin Lee, Dong Hwa Kim, In-Sik Nam +2 more | 2002-04-30 |
| 6292300 | Apparatus for generating independent coherent beam array using 45-degree mirrors | Sukhan Lee, Jideog Kim | 2001-09-18 |
| 6292304 | Apparatus for generating independent coherent beam array | Jideog Kim, Sukhan Lee | 2001-09-18 |