Issued Patents All Time
Showing 51–75 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10620656 | Operating voltage switching device with current mirror | Chih-Cheng Lin, Hui-Min Huang | 2020-04-14 |
| 10560703 | FLC-based image compression method and device | Wen-Tsung Huang, Shih-Tse Chen | 2020-02-11 |
| 10528809 | Iris image capturing device, iris image recognition device and method thereof | Wen-Tsung Huang | 2020-01-07 |
| 10530996 | Electronic device | Wen-Tsung Huang | 2020-01-07 |
| 10453774 | Thermally enhanced substrate | Bin Yang, Xia Li | 2019-10-22 |
| 10433425 | Three-dimensional high quality passive structure with conductive pillar technology | Changhan Hobie Yun, Jonghae Kim, Mario Francisco Velez | 2019-10-01 |
| 10339635 | Image processing method and image processing apparatus | Ching-Ju Hsiao, Wen-Tsung Huang | 2019-07-02 |
| 10211171 | Antenna in embedded wafer-level ball-grid array package | Yaojian Lin | 2019-02-19 |
| 10110243 | Successive approximation register analog-to-digital converter capable of accelerating reset | Yun-Tse Chen | 2018-10-23 |
| 10079591 | Resistance calibration circuit and device | Hui-Min Huang | 2018-09-18 |
| 9895823 | Miter saw | Youyu Lin | 2018-02-20 |
| 9806040 | Antenna in embedded wafer-level ball-grid array package | Yaojian Lin | 2017-10-31 |
| 9704857 | Semiconductor device and method of forming RF FEM with LC filter and IPD filter over substrate | HyunTai Kim, YongTaek Lee, Gwang Kim, ByungHoon Ahn | 2017-07-11 |
| 9685973 | Successive approximation register (SAR) analog-to-digital converting circuit and method thereof | Che-Wei Chang, Sheng-Hsiung Lin, Shih-Hsiun Huang | 2017-06-20 |
| 9501088 | Clock generator, communication device and sequential clock gating circuit | Chih-Jung Chiang, Shun-Te Tseng, Jian-Ru Lin | 2016-11-22 |
| 9484334 | Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processing | Robert C. Frye | 2016-11-01 |
| 9443815 | Embedded die redistribution layers for active device | Kumar Nagarajan, Satbir Madra | 2016-09-13 |
| 9412684 | Top exposed semiconductor chip package | Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz, Anup Bhalla, Jun Lu | 2016-08-09 |
| 9368563 | Semiconductor device including integrated passive device formed over semiconductor die with conductive bridge and fan-out redistribution layer | Yaojian Lin, Kang Chen | 2016-06-14 |
| 9343396 | Semiconductor device and method of forming IPD in fan-out wafer level chip scale package | Yaojian Lin, Robert C. Frye, Pandi C. Marimuthu | 2016-05-17 |
| 9337132 | Methods and configuration for manufacturing flip chip contact (FCC) power package | Ming Sun, Xiaotian Zhang, Yueh-Se Ho, Leeshawn Luo | 2016-05-10 |
| 9318671 | High efficiency light emitting diode package suitable for wafer level packaging | Chao-Kun Lin | 2016-04-19 |
| 9218987 | Method for top-side cooled semiconductor package with stacked interconnection plates | Francois Hebert, Lei Shi | 2015-12-22 |
| 9190340 | Semiconductor device and method of forming RF FEM and RF transceiver in semiconductor package | YongTaek Lee, HyunTai Kim, Gwang Kim, ByungHoon Ahn | 2015-11-17 |
| 9165866 | Stacked dual chip package having leveling projections | Hamza Yilmaz, Xiaotian Zhang, Yan Xun Xue, Anup Bhalla, Jun Lu +2 more | 2015-10-20 |