Issued Patents All Time
Showing 101–125 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8456221 | Voltage operation system | — | 2013-06-04 |
| 8446210 | Electronic fuse system | — | 2013-05-21 |
| 8390391 | Semiconductor device and method of integrating balun and RF coupler on a common substrate | Robert C. Frye | 2013-03-05 |
| 8373257 | Top exposed clip with window array | Lei Shi, Zhao Liang | 2013-02-12 |
| 8358179 | Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processing | Robert C. Frye | 2013-01-22 |
| 8354740 | Top-side cooled semiconductor package with stacked interconnection plates and method | Francois Hebert, Lei Shi | 2013-01-15 |
| 8349648 | Semiconductor device and method of forming RF FEM with IC filter and IPD filter over substrate | HyunTai Kim, YongTaek Lee, Gwang Kim, ByungHoon Ahn | 2013-01-08 |
| 8269575 | Semiconductor device and method of forming RF balun having reduced capacitive coupling and high CMRR | Robert C. Frye | 2012-09-18 |
| 8264084 | Solder-top enhanced semiconductor device for low parasitic impedance packaging | Francois Hebert, Anup Bhalla, Ming Sun | 2012-09-11 |
| 8241952 | Semiconductor device and method of forming IPD in fan-out level chip scale package | Yaojian Lin, Robert C. Frye, Pandi C. Marimuthu | 2012-08-14 |
| 8228154 | Miniaturized wide-band baluns for RF applications | Robert C. Frye | 2012-07-24 |
| 8183662 | Compact semiconductor package with integrated bypass capacitor | Francois Hebert | 2012-05-22 |
| 8154108 | Dual-leadframe multi-chip package and method of manufacture | Lei Shi, Jun Lu, Anup Bhalla | 2012-04-10 |
| 8111112 | Semiconductor device and method of forming compact coils for high performance filter | Robert C. Frye | 2012-02-07 |
| 8111113 | Semiconductor device and method of forming thin film capacitor | Robert C. Frye | 2012-02-07 |
| 8062932 | Compact semiconductor package with integrated bypass capacitor and method | Francois Hebert | 2011-11-22 |
| 8053874 | Semiconductor package having a bridge plate connection | Ming Sun, Lei Shi | 2011-11-08 |
| 8035458 | Semiconductor device and method of integrating balun and RF coupler on a common substrate | Robert C. Frye | 2011-10-11 |
| 7951651 | Dual flat non-leaded semiconductor package | Xiaotian Zhang, Ming Sun, Leeshawn Luo | 2011-05-31 |
| 7906375 | Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates | Ming Sun | 2011-03-15 |
| 7906839 | Semiconductor device and method of shunt test measurement for passive circuits | Robert C. Frye, Yaojian Lin | 2011-03-15 |
| 7897438 | Method of making semiconductor package with plated connection | Leeshawn Luo, Ming Sun, Xiao Zhang | 2011-03-01 |
| 7892858 | Semiconductor package with stacked semiconductor die each having IPD and method of reducing mutual inductive coupling by providing selectable vertical and lateral separation between IPD | Robert C. Frye | 2011-02-22 |
| 7884469 | Semiconductor package having a bridged plate interconnection | Lei Shi, Ming Sun | 2011-02-08 |
| 7811904 | Method of fabricating a semiconductor device employing electroless plating | Tao Feng, Ming Sun, Yueh-Se Ho | 2010-10-12 |