Issued Patents All Time
Showing 76–100 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9147586 | Semiconductor package with connecting plate for internal connection | Jun Lu, Yan Xun Xue | 2015-09-29 |
| 9040357 | Semiconductor packaging method using connecting plate for internal connection | Jun Lu, Yan Xun Xue | 2015-05-26 |
| 8981866 | Semiconductor device and method of forming RF balun having reduced capacitive coupling and high CMRR | Robert C. Frye | 2015-03-17 |
| 8975980 | Semiconductor device having balanced band-pass filter implemented with LC resonators | Robert C. Frye, Yaojian Lin | 2015-03-10 |
| 8951847 | Package leadframe for dual side assembly | Nikhil Vishwanath Kelkar | 2015-02-10 |
| 8933549 | Dual-leadframe multi-chip package | Lei Shi, Jun Lu, Anup Bhalla | 2015-01-13 |
| 8921127 | Semiconductor device and method of simultaneous testing of multiple interconnects for electro-migration | Robert C. Frye | 2014-12-30 |
| 8861160 | Integrated circuit having ESD protection capability | Chien-Ming Wu | 2014-10-14 |
| 8823466 | Miniaturized wide-band baluns for RF applications | Robert C. Frye | 2014-09-02 |
| 8815649 | Multi-layer lead frame package and method of fabrication | Jun Lu, Ming Sun, Yueh-Se Ho, Lei Shi | 2014-08-26 |
| 8803630 | Miniaturized wide-band baluns for RF applications | Robert C. Frye | 2014-08-12 |
| 8791775 | Semiconductor device and method of forming high-attenuation balanced band-pass filter | Robert C. Frye | 2014-07-29 |
| 8786333 | Phase calibration device and phase calibration method | Jian-Ru Lin | 2014-07-22 |
| 8722466 | Semiconductor packaging and fabrication method using connecting plate for internal connection | Jun Lu, Yan Xun Xue | 2014-05-13 |
| 8724680 | Transceiver without using a crystal oscillator | Ming-Feng Hsu, Tzu-Han Hsu, Yuan-Jih Chu | 2014-05-13 |
| 8709867 | Dual-leadframe multi-chip package and method of manufacture | Lei Shi, Jun Lu, Anup Bhalla | 2014-04-29 |
| 8680658 | Conductive clip for semiconductor device package | Lei Shi, Ming Sun | 2014-03-25 |
| 8624353 | Semiconductor device and method of forming integrated passive device over semiconductor die with conductive bridge and fan-out redistribution layer | Yaojian Lin, Kang Chen | 2014-01-07 |
| 8581376 | Stacked dual chip package and method of fabrication | Hamza Yilmaz, Xiaotian Zhang, Yan Xun Xue, Anup Bhalla, Jun Lu +2 more | 2013-11-12 |
| 8576026 | Semiconductor device having balanced band-pass filter implemented with LC resonator | Robert C. Frye, Yaojian Lin | 2013-11-05 |
| 8564382 | Miniaturized wide-band baluns for RF applications | Robert C. Frye | 2013-10-22 |
| 8563360 | Power semiconductor device package and fabrication method | Jun Lu, Francois Hebert, Xiaotian Zhang | 2013-10-22 |
| 8564049 | Flip chip contact (FCC) power package | Ming Sun, Xiao Zhang, Yueh-Se Ho, Leeshawn Luo | 2013-10-22 |
| 8513784 | Multi-layer lead frame package and method of fabrication | Jun Lu, Ming Sun, Yueh-Se Ho, Lei Shi | 2013-08-20 |
| 8497160 | Method for making solder-top enhanced semiconductor device of low parasitic packaging impedance | Francois Hebert, Anup Bhalla, Ming Sun | 2013-07-30 |