Issued Patents All Time
Showing 126–137 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7781265 | DFN semiconductor package having reduced electrical resistance | Xiaotian Zhang, Ming Sun | 2010-08-24 |
| 7776658 | Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates | Ming Sun | 2010-08-17 |
| 7688160 | Compact coils for high performance filters | Robert C. Frye | 2010-03-30 |
| 7683464 | Semiconductor package having dimpled plate interconnections | Ming Sun, Lei Shi | 2010-03-23 |
| 7659191 | Gold/silicon eutectic die bonding method | Ming Sun | 2010-02-09 |
| 7629860 | Miniaturized wide-band baluns for RF applications | Robert C. Frye | 2009-12-08 |
| 7622796 | Semiconductor package having a bridged plate interconnection | Lei Shi, Ming Sun | 2009-11-24 |
| 7612439 | Semiconductor package having improved thermal performance | Xiaotian Zhang, Argo Chang, James Cheng Lee, Ryan Huang, Ming Sun | 2009-11-03 |
| 7511361 | DFN semiconductor package having reduced electrical resistance | Xiaotian Zhang, Ming Sun | 2009-03-31 |
| 7394151 | Semiconductor package with plated connection | Leeshawn Luo, Ming Sun, Xiao Zhang | 2008-07-01 |
| 7242010 | GaSe crystals for broadband terahertz wave detection | Xi Zhang, Jingzhou Xu | 2007-07-10 |
| 7091506 | Semiconductor surface-field emitter for T-ray generation | Xi Zhang, Jingzhou Xu | 2006-08-15 |