Semiconductor package with a through port for sensor applications

Assignee

• Infineon Technologies Ag

Inventors

• Dominic Maier (28 patents)
• Matthias Steiert (15 patents)
• Chau Fatt Chiang (30 patents)
• Christian Geissler (53 patents)
• Bernd Goller (32 patents)
• Thomas Kilger (25 patents)
• Johannes Lodermeyer (12 patents)
• Franz-Xaver Muehlbauer (7 patents)
• Chee Yang Ng (22 patents)
• Beng Keh See (9 patents)
• Claus Waechter (9 patents)

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