Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dipped coated electronic module assembly with enhanced thermal distribution

Dipped coated electronic module assembly with enhanced thermal distribution

US Patent 12232302 · Granted Feb 18, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Hybrid embedded package2025
Leadframe, semiconductor package and method2025
Semiconductor package with metal posts from structured leadframe2024
Voltage regulator module with inductor-cooled power stage2024
Method of forming a chip package, method of forming a semiconductor arrangement,2024
Stacked transistor chip package with source coupling2024
Semiconductor package having a chip carrier with a pad offset feature2024
Dual step laser processing of an encapsulant of a semiconductor chip package2023
Semiconductor device with a heterogeneous solder joint and method for fabricatin2023
Semiconductor package having a chip carrier and a metal plate sized independentl2023
Hybrid embedded package2022
Lead frame-based semiconductor package2022