Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115794 | Semiconductor device comprising accumulation layer channel and inversion layer channel | Dae Hwan Chun, Youngkyun Jung, Jongseok Lee, Taeyeop KIM, Hyuk Woo | 2018-10-30 |
| 10033859 | Mobile terminal and method of controlling same | Youjin Jeon, Byoungzoo JEONG, Yoonchan Won, Weonbog Bae, Jinhae CHOI | 2018-07-24 |
| 9977528 | Electronic device having touch sensor | Jeonghun Kim, Kyungjung Kim, Changhyun Ahn, Hyejeon Jung, Gajin SONG +2 more | 2018-05-22 |
| 9780063 | Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer | JoonYoung Choi, SungWon Cho | 2017-10-03 |
| 9733752 | Mobile terminal and control method thereof | Jongseok Park, Jaeyoung JI, Younghoon Lee, Byoungzoo JEONG, Nayeoung Kim +5 more | 2017-08-15 |
| 9530753 | Integrated circuit packaging system with chip stacking and method of manufacture thereof | Daesup Kim, DaeSik Choi | 2016-12-27 |
| 9521241 | Mobile terminal and method of controlling the same | Soyeon YIM, Jonghoon Kim, Jinhae CHOI, Ilhyun Kim, Bonjoon KOO | 2016-12-13 |
| 9491370 | Methods and apparatuses for providing guide information for a camera | Jaeyung YEO, Soyoung Kim, Bokun CHOI | 2016-11-08 |
| 9318380 | Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant | SangMi Park, YongHyuk Jeong | 2016-04-19 |
| 9111076 | Mobile terminal and control method thereof | Jongseok Park, Jaeyoung JI, Younghoon Lee, Byoungzoo JEONG, Nayeoung Kim +5 more | 2015-08-18 |
| 8835301 | Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer | JoonYoung Choi, SungWon Cho | 2014-09-16 |
| 8816404 | Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant | SangMi Park, YongHyuk Jeong | 2014-08-26 |
| 8304900 | Integrated circuit packaging system with stacked lead and method of manufacture thereof | Ki Youn Jang, JoHyun Bae | 2012-11-06 |
| 8247893 | Mountable integrated circuit package system with intra-stack encapsulation | Soo-San Park | 2012-08-21 |
| 8115301 | Methods for manufacturing thermally enhanced flip-chip ball grid arrays | KyungOe Kim, Hyunsoo Shin | 2012-02-14 |
| 8110908 | Integrated circuit packaging system using bottom flip chip die bonding and method of manufacture thereof | Ki Youn Jang | 2012-02-07 |
| 7898072 | Package stacking system with mold contamination prevention | YoRim Lee | 2011-03-01 |