Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656770 | Thermal enhancement approach using solder compositions in the liquid state | Eugene Atwood, Joseph A. Benenati, Giulio DiGiacomo | 2003-12-02 |
| 6281573 | Thermal enhancement approach using solder compositions in the liquid state | Eugene Atwood, Joseph A. Benenati, Giulio DiGiacomo | 2001-08-28 |
| 6212070 | Zero force heat sink | Eugene Atwood, Joseph A. Benenati, James J. Dankelman, Karl J. Puttlitz, Eric J. Kastberg | 2001-04-03 |
| 6016947 | Non-destructive low melt test for off-composition solder | Timothy W. Donahue, Ellyn M. Ingalls, Chon Cheong Lei, Wai Mon Ma, Charles L. Reynolds +1 more | 2000-01-25 |
| 5805430 | Zero force heat sink | Eugene Atwood, Joseph A. Benenati, James J. Dankelman, Karl J. Puttlitz, Eric J. Kastberg | 1998-09-08 |
| 4962294 | Method and apparatus for causing an open circuit in a conductive line | Keith F. Beckham, David Carroll Challener, Arunava Gupta, Joseph M. Harvilchuck, James M. Leas +4 more | 1990-10-09 |
| 4611746 | Process for forming improved solder connections for semiconductor devices with enhanced fatigue life | Ernest N. Levine, Lewis D. Lipschutz | 1986-09-16 |
| 4604644 | Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making | Keith F. Beckham, Anne Elizabeth Kolman, Kathleen Mary McGuire, Karl J. Puttlitz | 1986-08-05 |