Issued Patents All Time
Showing 26–50 of 141 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10529671 | Package structure and method for forming the same | Hsiao-Wen Lee, Shin-Puu Jeng | 2020-01-07 |
| 10510690 | Wafer level package (WLP) and method for forming the same | Shin-Puu Jeng | 2019-12-17 |
| 10437499 | Hybrid memory system and method of operating the same | Chung-Hsun Lee | 2019-10-08 |
| 10380024 | DRAM and method of operating the same in an hierarchical memory system | Chung-Hsun Lee | 2019-08-13 |
| 10354713 | DRAM and method for determining binary logic using a test voltage level | Chung-Hsun Lee | 2019-07-16 |
| 10354988 | Using metal-containing layer to reduce carrier shock in package formation | Shin-Puu Jeng, Yi-Jou Lin | 2019-07-16 |
| 10347574 | Integrated fan-out packages | Shin-Puu Jeng, Dai-Jang Chen, Hsiang-Tai Lu, Chih-Hsien Lin, Shih-Ting Hung +1 more | 2019-07-09 |
| 10338831 | System and method for preserving data in volatile memory | Chung-Hsun Lee | 2019-07-02 |
| 10332580 | DRAM and method for determining binary logic using a test voltage level | Chung-Hsun Lee | 2019-06-25 |
| 10332579 | DRAM and method for operating the same | Chung-Hsun Lee | 2019-06-25 |
| 10297304 | Memory device and operating method thereof | Chung-Hsun Lee | 2019-05-21 |
| 10290605 | Fan-out package structure and method for forming the same | Shin-Puu Jeng, Po-Yao Chuang, Tzu-Jui Fang, Yi-Jou Lin | 2019-05-14 |
| 10290590 | Stacked semiconductor device and method of manufacturing the same | Shin-Puu Jeng, Tzu-Jui Fang, Hsi-Kuei Cheng, Chih-Kang Han, Yi-Jen Lai +1 more | 2019-05-14 |
| 10276228 | DRAM and method of operating the same | Chung-Hsun Lee | 2019-04-30 |
| 10269445 | Memory device and operating method thereof | Chung-Hsun Lee | 2019-04-23 |
| 10262719 | DRAM and refresh method thereof | Chung-Hsun Lee | 2019-04-16 |
| 10236035 | DRAM memory device adjustable refresh rate method to alleviate effects of row hammer events | Chung-Hsun Lee | 2019-03-19 |
| 10141043 | DRAM and method for managing power thereof | Chung-Hsun Lee | 2018-11-27 |
| 10127967 | DRAM and method for operating the same | Chung-Hsun Lee | 2018-11-13 |
| 10083949 | Using metal-containing layer to reduce carrier shock in package formation | Shin-Puu Jeng, Yi-Jou Lin | 2018-09-25 |
| 10074637 | Structure and formation method for chip package | Jui-Pin Hung, Cheng-Lin Huang, Shin-Puu Jeng | 2018-09-11 |
| 10074617 | Wafer level package (WLP) and method for forming the same | Shin-Puu Jeng | 2018-09-11 |
| 10049714 | DRAM and method for managing power thereof | Chung-Hsun Lee | 2018-08-14 |
| 10019350 | Dram and method for accessing a dram | Chung-Hsun Lee | 2018-07-10 |
| 9950450 | Molding chamber apparatus and curing method | Jing-Cheng Lin, Chen-Hua Yu, Shin-Puu Jeng, Jui-Pin Hung | 2018-04-24 |