WY

Wen-Cheng Yang

NP Nan Ya Plastics: 23 patents #4 of 139Top 3%
TSMC: 14 patents #2,167 of 12,232Top 20%
NU National Tsing Hua University: 1 patents #672 of 2,036Top 35%
Overall (All Time): #84,945 of 4,157,543Top 3%
38
Patents All Time

Issued Patents All Time

Showing 26–38 of 38 patents

Patent #TitleCo-InventorsDate
11383502 Recyclable retort pouch and recyclable retort polyester film thereof Te-Chao Liao, CHING-YAO YUAN, Chia-Yen Hsiao 2022-07-12
11111910 Ultra high vacuum cryogenic pumping apparatus with nanostructure material Surendra Babu Anantharaman, Chung-En Kao, Victor Lu, Wei-Kuo Chin 2021-09-07
11021603 White polyester film with properties of lightweight and low-shrinkage Te-Chao Liao, CHUN-CHE TSAO, Chia-Yen Hsiao, Chih-Feng Wang 2021-06-01
10811263 Method for forming semiconductor device structure with etch stop layer Ya-Ling Lee, Shing-Chyang Pan, Keng-Chu Lin, Chih-Tsung Lee, Victor Lu 2020-10-20
10668763 Pet synthetic paper Te-Chao Liao, CHING-YAO YUAN, Chen An Wu, Yu-Chi Hsieh 2020-06-02
10522360 Method for forming semiconductor device structure with etch stop layer Ya-Ling Lee, Shing-Chyang Pan, Keng-Chu Lin, Chih-Tsung Lee, Victor Lu 2019-12-31
10145371 Ultra high vacuum cryogenic pumping apparatus with nanostructure material Surendra Babu Anantharaman, Chung-En Kao, Victor Lu, Wei-Kuo Chin 2018-12-04
10121698 Method of manufacturing a semiconductor device Hsiang-Huan Lee, Shau-Lin Shue, Kuang-Kuo Koai, Hai-Ching Chen, Tung-Ching Tseng +3 more 2018-11-06
9548241 Semiconductor device metallization systems and methods Hsiang-Huan Lee, Shau-Lin Shue, Keith Kuang-Kuo Koai, Hai-Ching Chen, Tung-Ching Tseng +3 more 2017-01-17
9472502 Cobalt interconnect techniques Ya-Ling Lee, Victor Lu 2016-10-18
9318364 Semiconductor device metallization systems and methods Hsiang-Huan Lee, Shau-Lin Shue, Keith Kuang-Kuo Koai, Hai-Ching Chen, Tung-Ching Tseng +3 more 2016-04-19
9026241 Closed loop control for reliability Chung-En Kao, You-Hua Chou, Ming-Chih Tsai, Chen-Chia Chiang, Bo-Hung Lin +1 more 2015-05-05
7947430 Method of forming 3D micro structures with high aspect ratios Chien-Chung Fu, Heng-Chi Huang 2011-05-24