Issued Patents All Time
Showing 76–100 of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5592019 | Semiconductor device and module | Kisamitsu Ono, Kou Shimomura, Hideyuki Ichiyama | 1997-01-07 |
| 5576247 | Thin layer forming method wherein hydrophobic molecular layers preventing a BPSG layer from absorbing moisture | Kousaku Yano, Masayuki Endo, Yuka Terai, Noboru Nomura, Tomoyasu Murakami +1 more | 1996-11-19 |
| 5545919 | Semiconductor device and method of fabricating the same | Satoshi Ueda, Atsuhiro Yamano, Kousaku Yano | 1996-08-13 |
| 5518513 | Dust removing apparatus | Atsumasa Iwanaga, Kiyoshi Nagashima, Hisataka Urakata, Tetsuya Fujino | 1996-05-21 |
| 5508232 | Method of manufacturing a semiconductor device | Kazunari Michii, Yutaka Koyama, Naoto Ueda | 1996-04-16 |
| 5385867 | Method for forming a multi-layer metallic wiring structure | Kousaku Yano, Tomoyasu Murakami, Michinari Yamanaka, Shuji Hirao, Noboru Nomura | 1995-01-31 |
| 5334872 | Encapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die pad | Osamu Nakagawa | 1994-08-02 |
| 5327012 | Semiconductor device having a double-layer interconnection structure | Kohsaku Yano, Teruhito Ohnishi, Hiroshi Nishimura | 1994-07-05 |
| 5309021 | Semiconductor device having particular power distribution interconnection arrangement | Haruo Shimamoto, Jun Shibata, Toru Tachikawa, Hiroshi Seki | 1994-05-03 |
| 5295752 | Printer using double sheets of pressure sensitive paper | Shinsuke Kawamoto, Osamu Miyajima | 1994-03-22 |
| 5198884 | Semiconductor devices having a double-layer interconnection structure | Kohsaku Yano, Teruhito Ohnishi, Hiroshi Nishimura | 1993-03-30 |
| 5196917 | Carrier tape | Kou Shimomura, Osamu Nakagawa, Seiji Takemura, Kazunari Michii | 1993-03-23 |
| 5180436 | Microwave plasma film deposition system | Naoki Suzuki, Kohsaku Yano | 1993-01-19 |
| 5166099 | Manufacturing method for semiconductor device | Osami Nakagawa, Haruo Shimamoto, Yasuhiro Teraoka, Seiji Takemura | 1992-11-24 |
| 5157478 | Tape automated bonding packaged semiconductor device incorporating a heat sink | Haruo Shimamoto, Yasuhiro Teraoka, Hideya Yagoura, Hiroshi Seki | 1992-10-20 |
| 5134093 | Method of fabricating a semiconductor device including a protective layer | Teruhito Onishi | 1992-07-28 |
| 5125358 | Microwave plasma film deposition system | Naoki Suzuki, Kohsaku Yano | 1992-06-30 |
| 5126824 | Carrier tape and method of manufacturing semiconductor device employing the same | — | 1992-06-30 |
| 5105261 | Semiconductor device package having particular lead structure for mounting multiple circuit boards | Toru Tachikawa, Masataka Takehara | 1992-04-14 |
| 5083191 | Semiconductor device | — | 1992-01-21 |
| 5076877 | Apparatus for dry etching | Kohsaku Yano | 1991-12-31 |
| 5073817 | Resin encapsulated semiconductor device with heat radiator | — | 1991-12-17 |
| 5064706 | Carrier tape including molten resin flow path element for resin packaged semiconductor devices | Haruo Shimamoto, Hideya Yagoura, Hiroshi Seki, Yasuhiro Teraoka | 1991-11-12 |
| 5031026 | Thin semiconductor card | — | 1991-07-09 |
| 5025307 | Modular semiconductor device | Toru Tachikawa, Masataka Takehara | 1991-06-18 |