YT

Yuka Terai

Sumitomo Electric Industries: 10 patents #2,734 of 21,551Top 15%
MC Matsushit Electric Industrial Co.: 1 patents #13 of 293Top 5%
Overall (All Time): #469,789 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
7171640 System and method for operation verification of semiconductor integrated circuit Kyoji Yamashita 2007-01-30
6372928 Layer forming material and wiring forming method Akemi Kawaguchi, Kousaku Yano 2002-04-16
5863338 Apparatus and method for forming thin film Yuichiro Yamada, Naoki Suzuki, Ryuzo Houchin, Noboru Nomura, Kousaku Yano 1999-01-26
5773639 Layer forming material and wiring forming method Akemi Kawaguchi, Kousaku Yano 1998-06-30
5693557 Method of fabricating a semiconductor device Shuji Hirao, Hisashi Ogawa, Mitsuru Sekiguchi, Masanori Fukumoto, Isao Miyanaga 1997-12-02
5661068 Method of fabricating a semiconductor device Shuji Hirao, Hisashi Ogawa, Mitsuru Sekiguchi, Masanori Fukumoto, Isao Miyanaga 1997-08-26
5633211 Semiconductor device and process Shinichi Imai, Masanori Fukumoto, Kousaku Yano, Hiroyuki Umimoto, Shinji Odanaka +1 more 1997-05-27
5576247 Thin layer forming method wherein hydrophobic molecular layers preventing a BPSG layer from absorbing moisture Kousaku Yano, Masayuki Endo, Noboru Nomura, Tomoyasu Murakami, Tetsuya Ueda +1 more 1996-11-19
5501739 Apparatus and method for forming thin film Yuichiro Yamada, Naoki Suzuki, Ryuzo Houchin, Noboru Nomura, Kousaku Yano 1996-03-26
5474949 Method of fabricating capacitor or contact for semiconductor device by forming uneven oxide film and reacting silicon with metal containing gas Shuji Hirao, Hisashi Ogawa, Mitsuru Sekiguchi, Masanori Fukumoto, Isao Miyanaga 1995-12-12
5314848 Method for manufacturing a semiconductor device using a heat treatment according to a temperature profile that prevents grain or particle precipitation during reflow Takatoshi Yasui, Chiaki Kudo, Ichiro Nakao, Toyokazu Fujii, Shinichi Imai +2 more 1994-05-24