Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7217353 | Method and apparatus for plating substrate | — | 2007-05-15 |
| 7001841 | Production method of semiconductor device | Takeshi Harada, Kazushi Nii, Takenobu Kishida, Atsushi Ikeda, Kazunori Tsuji | 2006-02-21 |
| 5753536 | Semiconductor device and associated fabrication method | Tatsuo Sugiyama, Kousaku Yano, Noboru Nomura | 1998-05-19 |
| 5714400 | Method for forming a memory device by utilizing variations in resistance value | Hideko Okada, Kousaku Yano | 1998-02-03 |
| 5693557 | Method of fabricating a semiconductor device | Hisashi Ogawa, Yuka Terai, Mitsuru Sekiguchi, Masanori Fukumoto, Isao Miyanaga | 1997-12-02 |
| 5661068 | Method of fabricating a semiconductor device | Hisashi Ogawa, Yuka Terai, Mitsuru Sekiguchi, Masanori Fukumoto, Isao Miyanaga | 1997-08-26 |
| 5621247 | Memory device with tungsten and aluminum interconnects | Hideko Okada, Kousaku Yano | 1997-04-15 |
| 5474949 | Method of fabricating capacitor or contact for semiconductor device by forming uneven oxide film and reacting silicon with metal containing gas | Hisashi Ogawa, Yuka Terai, Mitsuru Sekiguchi, Masanori Fukumoto, Isao Miyanaga | 1995-12-12 |
| 5385867 | Method for forming a multi-layer metallic wiring structure | Tetsuya Ueda, Kousaku Yano, Tomoyasu Murakami, Michinari Yamanaka, Noboru Nomura | 1995-01-31 |