Issued Patents All Time
Showing 401–425 of 448 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5314843 | Integrated circuit polishing method | Chris C. Yu, Gurtej S. Sandhu | 1994-05-24 |
| RE34583 | Method of forming a configuration of interconnections on a semiconductor device having a high integration density | Malcolm Grief, Hendrikus J. W. van Houtum, Josephus M. F. G. Van Laarhoven | 1994-04-12 |
| 5292683 | Method of isolating semiconductor devices and arrays of memory integrated circuitry | Charles H. Dennison | 1994-03-08 |
| 5278100 | Chemical vapor deposition technique for depositing titanium silicide on semiconductor wafers | Gurtej S. Sandhu | 1994-01-11 |
| 5270263 | Process for depositing aluminum nitride (AlN) using nitrogen plasma sputtering | Sung-Cheol Kim, Chris C. Yu | 1993-12-14 |
| 5259799 | Method to form self-aligned gate structures and focus rings | Tyler Lowrey, David A. Cathey, J. Brett Rolfson | 1993-11-09 |
| 5254499 | Method of depositing high density titanium nitride films on semiconductor wafers | Gurtej S. Sandhu, Scott Meikle | 1993-10-19 |
| 5252518 | Method for forming a mixed phase TiN/TiSi film for semiconductor manufacture using metal organometallic precursors and organic silane | Gurtej S. Sandhu | 1993-10-12 |
| 5244534 | Two-step chemical mechanical polishing process for producing flush and protruding tungsten plugs | Chris C. Yu | 1993-09-14 |
| 5240871 | Corrugated storage contact capacitor and method for forming a corrugated storage contact capacitor | David A. Cathey | 1993-08-31 |
| 5240739 | Chemical vapor deposition technique for depositing titanium silicide on semiconductor wafers | Gurtej S. Sandhu | 1993-08-31 |
| 5236865 | Method for simultaneously forming silicide and effecting dopant activation on a semiconductor wafer | Gurtej S. Sandhu, Chang Yu | 1993-08-17 |
| 5234867 | Method for planarizing semiconductor wafers with a non-circular polishing pad | Laurence D. Schultz, Mark E. Tuttle | 1993-08-10 |
| 5232875 | Method and apparatus for improving planarity of chemical-mechanical planarization operations | Mark E. Tuttle, Angus C. Fox, III, Gurtej S. Sandhu, Hugh E. Stroupe | 1993-08-03 |
| 5232549 | Spacers for field emission display fabricated via self-aligned high energy ablation | David A. Cathey, Chris C. Yu, Tyler Lowrey, J. Brett Rolfson | 1993-08-03 |
| 5229331 | Method to form self-aligned gate structures around cold cathode emitter tips using chemical mechanical polishing technology | J. Brett Rolfson, Tyler Lowrey, David A. Cathey | 1993-07-20 |
| 5225034 | Method of chemical mechanical polishing predominantly copper containing metal layers in semiconductor processing | Chris C. Yu | 1993-07-06 |
| 5223734 | Semiconductor gettering process using backside chemical mechanical planarization (CMP) and dopant diffusion | Tyler Lowrey, Gurtej S. Sandhu | 1993-06-29 |
| 5223081 | Method for roughening a silicon or polysilicon surface for a semiconductor substrate | — | 1993-06-29 |
| 5212111 | Local-oxidation of silicon (LOCOS) process using ceramic barrier layer | Gurtej S. Sandhu | 1993-05-18 |
| 5209816 | Method of chemical mechanical polishing aluminum containing metal layers and slurry for chemical mechanical polishing | Chris C. Yu, Alan Laulusa | 1993-05-11 |
| 5206187 | Method of processing semiconductor wafers using a contact etch stop | Gurtej S. Sandhu | 1993-04-27 |
| 5205770 | Method to form high aspect ratio supports (spacers) for field emission display using micro-saw technology | Tyler Lowrey, David A. Cathey, J. Brett Rolfson | 1993-04-27 |
| 5204286 | Method of making self-aligned contacts and vertical interconnects to integrated circuits | — | 1993-04-20 |
| 5202278 | Method of forming a capacitor in semiconductor wafer processing | Viju K. Mathews, Chang Yu, Mark E. Tuttle | 1993-04-13 |