Issued Patents All Time
Showing 426–448 of 448 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5196360 | Methods for inhibiting outgrowth of silicide in self-aligned silicide process | Gurtej S. Sandhu | 1993-03-23 |
| 5196353 | Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer | Gurtej S. Sandhu | 1993-03-23 |
| 5186670 | Method to form self-aligned gate structures and focus rings | Tyler Lowrey, David A. Cathey, J. Brett Rolfson | 1993-02-16 |
| 5173441 | Laser ablation deposition process for semiconductor manufacture | Chang Yu | 1992-12-22 |
| 5173327 | LPCVD process for depositing titanium films for semiconductor devices | Gurtej S. Sandhu | 1992-12-22 |
| 5169491 | Method of etching SiO.sub.2 dielectric layers using chemical mechanical polishing techniques | — | 1992-12-08 |
| 5147819 | Semiconductor metallization method | Chang Yu, Gurtej S. Sandhu | 1992-09-15 |
| 5139967 | Process for planarizing insulating dielectric material | Gurtej S. Sandhu, Chang Yu | 1992-08-18 |
| 5136362 | Electrical contact with diffusion barrier | Malcolm Grief | 1992-08-04 |
| 5132236 | Method of semiconductor manufacture using an inverse self-aligned mask | — | 1992-07-21 |
| 5124780 | Conductive contact plug and a method of forming a conductive contact plug in an integrated circuit using laser planarization | Gurtej S. Sandhu, Chang Yu, Mark E. Tuttle | 1992-06-23 |
| 5094977 | Stress reduction in metal films by laser annealing | Chang Yu, Gurtej S. Sandhu | 1992-03-10 |
| 5073518 | Process to mechanically and plastically deform solid ductile metal to fill contacts of conductive channels with ductile metal and process for dry polishing excess metal from a semiconductor wafer | Mark E. Tuttle, Tyler Lowrey | 1991-12-17 |
| 5069002 | Apparatus for endpoint detection during mechanical planarization of semiconductor wafers | Gurtej S. Sandhu, Laurence D. Schultz | 1991-12-03 |
| 5036015 | Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers | Gurtej S. Sandhu, Laurence D. Schultz | 1991-07-30 |
| 5032233 | Method for improving step coverage of a metallization layer on an integrated circuit by use of a high melting point metal as an anti-reflective coating during laser planarization | Chang Yu, Gurtej S. Sandhu | 1991-07-16 |
| 5032545 | Process for preventing a native oxide from forming on the surface of a semiconductor material and integrated circuit capacitors produced thereby | Tyler Lowrey | 1991-07-16 |
| 5021353 | Split-polysilicon CMOS process incorporating self-aligned silicidation of conductive regions | Tyler Lowrey, Dermot M. Durcan, Gordon A. Haller, Mark E. Tuttle | 1991-06-04 |
| 5001079 | Method of manufacturing a semiconductor device by forming insulating side walls with voids below overhangs | Josephus M. F. G. Van Laarhoven, Wilhelmus F. M. Gootzen, Michael F. B. Bellersen | 1991-03-19 |
| 5001085 | Process for creating a metal etch mask which may be utilized for halogen-plasma excavation of deep trenches | David A. Cathey | 1991-03-19 |
| 4999160 | Aluminum alloy containing copper, silicon and titanium for VLSI devices | Tyler Lowrey | 1991-03-12 |
| 4992135 | Method of etching back of tungsten layers on semiconductor wafers, and solution therefore | — | 1991-02-12 |
| 4936950 | Method of forming a configuration of interconnections on a semiconductor device having a high integration density | Leendert De Bruin, Malcolm Grief, Harald Godon | 1990-06-26 |