| 12134087 |
Method for preparing pickering miniemulsion and its catalytic application |
Jieshan Qiu, Lin Ni, Ji-Rong Wen |
2024-11-05 |
| 10450669 |
Container for silicon ingot fabrication and manufacturing method thereof, and method for manufacturing crystalline silicon ingot |
Yen-Ming Chen |
2019-10-22 |
| 5380678 |
Bilayer barrier metal method for obtaining 100% step-coverage in contact vias without junction degradation |
Trung T. Doan |
1995-01-10 |
| 5236865 |
Method for simultaneously forming silicide and effecting dopant activation on a semiconductor wafer |
Gurtej S. Sandhu, Trung T. Doan |
1993-08-17 |
| 5202278 |
Method of forming a capacitor in semiconductor wafer processing |
Viju K. Mathews, Mark E. Tuttle, Trung T. Doan |
1993-04-13 |
| 5173441 |
Laser ablation deposition process for semiconductor manufacture |
Trung T. Doan |
1992-12-22 |
| 5147819 |
Semiconductor metallization method |
Trung T. Doan, Gurtej S. Sandhu |
1992-09-15 |
| 5139967 |
Process for planarizing insulating dielectric material |
Gurtej S. Sandhu, Trung T. Doan |
1992-08-18 |
| 5139974 |
Semiconductor manufacturing process for decreasing the optical refelctivity of a metal layer |
Gurtej S. Sandhu, Yauh-Ching Liu |
1992-08-18 |
| 5124780 |
Conductive contact plug and a method of forming a conductive contact plug in an integrated circuit using laser planarization |
Gurtej S. Sandhu, Trung T. Doan, Mark E. Tuttle |
1992-06-23 |
| 5106779 |
Method for widening the laser planarization process window for metalized films on semiconductor wafers |
— |
1992-04-21 |
| 5094977 |
Stress reduction in metal films by laser annealing |
Trung T. Doan, Gurtej S. Sandhu |
1992-03-10 |
| 5085080 |
Temperature and pressure measuring technique using the photoacoustic effect and mechanical resonance |
— |
1992-02-04 |
| 5066611 |
Method for improving step coverage of a metallization layer on an integrated circuit by use of molybdenum as an anti-reflective coating |
— |
1991-11-19 |
| 5032233 |
Method for improving step coverage of a metallization layer on an integrated circuit by use of a high melting point metal as an anti-reflective coating during laser planarization |
Trung T. Doan, Gurtej S. Sandhu |
1991-07-16 |
