Issued Patents All Time
Showing 1,126–1,150 of 1,397 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6306776 | Catalytic breakdown of reactant gases in chemical vapor deposition | Anand Srinivasan | 2001-10-23 |
| 6306009 | System for real-time control of semiconductor wafer polishing | Trung T. Doan | 2001-10-23 |
| 6303956 | Conductive container structures having a dielectric cap | Alan R. Reinberg | 2001-10-16 |
| 6303488 | Semiconductor processing methods of forming openings to devices and substrates, exposing material from which photoresist cannot be substantially selectively removed | Shubneesh Batra | 2001-10-16 |
| 6300219 | Method of forming trench isolation regions | Trung T. Doan | 2001-10-09 |
| 6294459 | Anti-reflective coatings and methods for forming and using same | Zhiping Yin | 2001-09-25 |
| 6291341 | Method for PECVD deposition of selected material films | Sujit Sharan | 2001-09-18 |
| 6291289 | Method of forming DRAM trench capacitor with metal layer over hemispherical grain polysilicon | Howard E. Rhodes, Lyle Breiner, Philip J. Ireland, Trung T. Doan, Sujit Sharan | 2001-09-18 |
| 6291340 | Method of forming low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer | Trung T. Doan, Tyler Lowrey | 2001-09-18 |
| 6291358 | Plasma deposition tool operating method | Sujit Sharan | 2001-09-18 |
| 6291363 | Surface treatment of DARC films to reduce defects in subsequent cap layers | Zhiping Yin | 2001-09-18 |
| 6284316 | Chemical vapor deposition of titanium | Donald L. Westmoreland | 2001-09-04 |
| 6281123 | Method of reducing carbon incorporation into films produced by chemical vapor deposition involving organic precursor compounds | — | 2001-08-28 |
| 6281142 | Dielectric cure for reducing oxygen vacancies | Cem Basceri | 2001-08-28 |
| 6281072 | Multiple step methods for forming conformal layers | Weimin Li | 2001-08-28 |
| 6281100 | Semiconductor processing methods | Zhiping Yin, Ravi Iyer, Thomas R. Glass, Richard Holscher, Ardavan Niroomand +1 more | 2001-08-28 |
| 6281104 | Low temperature reflow method for filling high aspect ratio contacts | Shubneesh Batra | 2001-08-28 |
| 6277737 | Semiconductor processing methods and integrated circuitry | Ravi Iyer | 2001-08-21 |
| 6271558 | Capacitors and capacitor construction | Kris K. Brown | 2001-08-07 |
| 6268282 | Semiconductor processing methods of forming and utilizing antireflective material layers, and methods of forming transistor gate stacks | Sujit Sharan | 2001-07-31 |
| 6261151 | System for real-time control of semiconductor wafer polishing | Trung T. Doan | 2001-07-17 |
| 6255209 | Methods of forming a contact having titanium formed by chemical vapor deposition | Trung T. Doan, Kirk D. Prall, Sujit Sharan | 2001-07-03 |
| 6255216 | Methods of forming a contact having titanium silicide and titanium formed by chemical vapor deposition | Trung T. Doan, Kirk D. Prall, Sujit Sharan | 2001-07-03 |
| 6255212 | Method of making a void-free aluminum film | Ravi Iyer | 2001-07-03 |
| 6249019 | Container capacitor with increased surface area and method for making same | Randhir P. S. Thakur | 2001-06-19 |