Issued Patents All Time
Showing 25 most recent of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756810 | Detection of force applied by pick-up tool for transferring semiconductor devices | Oscar Torrents Abad, Ali Sengül, Pooya Saketi | 2023-09-12 |
| 11735689 | Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating | Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon N. Farrens, Ali Sengül +1 more | 2023-08-22 |
| 11677051 | Application of underfill via centrifugal force | Zheng Sung Chio, Tennyson Nguty, Chao Kai Tung, Oscar Torrents Abad | 2023-06-13 |
| 11670531 | Bridge pick-up head for transferring semiconductor devices | Oscar Torrents Abad, Ali Sengül, Pooya Saketi | 2023-06-06 |
| 11579182 | Probe card for efficient screening of highly-scaled monolithic semiconductor devices | Christopher Percival, Zheng Sung Chio, Chao Kai Tung | 2023-02-14 |
| 11575069 | Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers | Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nanette Farrens, Ali Sengül | 2023-02-07 |
| 11563142 | Curing pre-applied and plasma-etched underfill via a laser | Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Ali Sengül | 2023-01-24 |
| 11557692 | Selectively bonding light-emitting devices via a pulsed laser | Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nanette Farrens | 2023-01-17 |
| 11424214 | Hybrid interconnect for laser bonding using nanoporous metal tips | Zheng Sung Chio, Oscar Torrents Abad, Jeb Wu, Ali Sengül | 2022-08-23 |
| 11417792 | Interconnect with nanotube fitting | Ali Sengül, Zheng Sung Chio, Oscar Torrents Abad, Jeb Wu, Tennyson Nguty | 2022-08-16 |
| 11404600 | Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers | Jeb Wu, Zheng Sung Chio, Tennyson Nguty, Oscar Torrents Abad, Ali Sengül | 2022-08-02 |
| 11374148 | Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating | Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nanette Farrens, Ali Sengül +1 more | 2022-06-28 |
| 11344971 | Microlens arrays for parallel micropatterning | Oscar Torrents Abad | 2022-05-31 |
| 11349053 | Flexible interconnect using conductive adhesive | Zheng Sung Chio, Ali Sengül, Oscar Torrents Abad, Jeb Wu, Pooya Saketi +3 more | 2022-05-31 |
| 11328942 | Liquid crystalline elastomer for pick and place of semiconductor devices | Thomas John Farrell Wallin, Yigit Mengue, Pooya Saketi, Ali Sengül, Nicholas Roy Corson +5 more | 2022-05-10 |
| 11296268 | Magnetic clamping interconnects | Ali Sengül, Oscar Torrents Abad, Zheng Sung Chio, Jeb Wu, Chao Kai Tung +2 more | 2022-04-05 |
| 11276672 | Bonding dummy electrodes of light emitting diode chip to substrate | Jeb Wu, Oscar Torrents Abad, Pooya Saketi, Zheng Sung Chio, Ali Sengül | 2022-03-15 |
| 11255529 | Bonding corners of light emitting diode chip to substrate using laser | Jeb Wu, Oscar Torrents Abad, Pooya Saketi, Zheng Sung Chio, Ali Sengül | 2022-02-22 |
| 11239400 | Curved pillar interconnects | Zheng Sung Chio, Oscar Torrents Abad, Ali Sengül, Pooya Saketi, Jeb Wu +4 more | 2022-02-01 |
| 11152533 | Etchant-accessible carrier substrate for display manufacture | Daniel Bryce Thompson, Pooya Saketi | 2021-10-19 |
| 11107948 | Fluidic pick-up head for assembling light emitting diodes | Yigit Menguc, Pooya Saketi, Thomas John Farrell Wallin, Nicholas Roy Corson, Ali Sengül +5 more | 2021-08-31 |
| 11101159 | Pickup head with photocurable polymers for assembling light emitting diodes | Oscar Torrents Abad, Ali Sengül, Pooya Saketi | 2021-08-24 |
| 11011687 | Micro light emitting diode with remnants of fabrication substrate for structural support | Allan Pourchet, Pooya Saketi, Oscar Torrents Abad | 2021-05-18 |
| 11005014 | Optics formation using pick-up tools | Patrick J. Hughes, Pooya Saketi, Oscar Torrents Abad | 2021-05-11 |
| 10998215 | Monitoring dry-etching of polymer layer for transferring semiconductor devices | — | 2021-05-04 |