| 11756810 |
Detection of force applied by pick-up tool for transferring semiconductor devices |
Oscar Torrents Abad, Ali Sengül, Pooya Saketi |
2023-09-12 |
$378,894,000 |
| 11735689 |
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating |
Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon N. Farrens, Ali Sengül +1 more |
2023-08-22 |
$320,369,000 |
| 11677051 |
Application of underfill via centrifugal force |
Zheng Sung Chio, Tennyson Nguty, Chao Kai Tung, Oscar Torrents Abad |
2023-06-13 |
$261,054,000 |
| 11670531 |
Bridge pick-up head for transferring semiconductor devices |
Oscar Torrents Abad, Ali Sengül, Pooya Saketi |
2023-06-06 |
$222,721,000 |
| 11579182 |
Probe card for efficient screening of highly-scaled monolithic semiconductor devices |
Christopher Percival, Zheng Sung Chio, Chao Kai Tung |
2023-02-14 |
$167,621,000 |
| 11575069 |
Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers |
Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nanette Farrens, Ali Sengül |
2023-02-07 |
$324,710,000 |
| 11563142 |
Curing pre-applied and plasma-etched underfill via a laser |
Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Ali Sengül |
2023-01-24 |
$131,221,000 |
| 11557692 |
Selectively bonding light-emitting devices via a pulsed laser |
Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nanette Farrens |
2023-01-17 |
$204,762,000 |
| 11424214 |
Hybrid interconnect for laser bonding using nanoporous metal tips |
Zheng Sung Chio, Oscar Torrents Abad, Jeb Wu, Ali Sengül |
2022-08-23 |
$154,256,000 |
| 11417792 |
Interconnect with nanotube fitting |
Ali Sengül, Zheng Sung Chio, Oscar Torrents Abad, Jeb Wu, Tennyson Nguty |
2022-08-16 |
$251,777,000 |
| 11404600 |
Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers |
Jeb Wu, Zheng Sung Chio, Tennyson Nguty, Oscar Torrents Abad, Ali Sengül |
2022-08-02 |
$157,559,000 |
| 11374148 |
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating |
Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nanette Farrens, Ali Sengül +1 more |
2022-06-28 |
$203,238,000 |
| 11344971 |
Microlens arrays for parallel micropatterning |
Oscar Torrents Abad |
2022-05-31 |
$184,600,000 |
| 11349053 |
Flexible interconnect using conductive adhesive |
Zheng Sung Chio, Ali Sengül, Oscar Torrents Abad, Jeb Wu, Pooya Saketi +3 more |
2022-05-31 |
$184,600,000 |
| 11328942 |
Liquid crystalline elastomer for pick and place of semiconductor devices |
Thomas John Farrell Wallin, Yigit Mengue, Pooya Saketi, Ali Sengül, Nicholas Roy Corson +5 more |
2022-05-10 |
$254,745,000 |
| 11296268 |
Magnetic clamping interconnects |
Ali Sengül, Oscar Torrents Abad, Zheng Sung Chio, Jeb Wu, Chao Kai Tung +2 more |
2022-04-05 |
$236,387,000 |
| 11276672 |
Bonding dummy electrodes of light emitting diode chip to substrate |
Jeb Wu, Oscar Torrents Abad, Pooya Saketi, Zheng Sung Chio, Ali Sengül |
2022-03-15 |
$320,007,000 |
| 11255529 |
Bonding corners of light emitting diode chip to substrate using laser |
Jeb Wu, Oscar Torrents Abad, Pooya Saketi, Zheng Sung Chio, Ali Sengül |
2022-02-22 |
$155,126,000 |
| 11239400 |
Curved pillar interconnects |
Zheng Sung Chio, Oscar Torrents Abad, Ali Sengül, Pooya Saketi, Jeb Wu +4 more |
2022-02-01 |
$122,837,000 |
| 11152533 |
Etchant-accessible carrier substrate for display manufacture |
Daniel Bryce Thompson, Pooya Saketi |
2021-10-19 |
$213,134,000 |
| 11107948 |
Fluidic pick-up head for assembling light emitting diodes |
Yigit Menguc, Pooya Saketi, Thomas John Farrell Wallin, Nicholas Roy Corson, Ali Sengül +5 more |
2021-08-31 |
$260,818,000 |
| 11101159 |
Pickup head with photocurable polymers for assembling light emitting diodes |
Oscar Torrents Abad, Ali Sengül, Pooya Saketi |
2021-08-24 |
$212,554,000 |
| 11011687 |
Micro light emitting diode with remnants of fabrication substrate for structural support |
Allan Pourchet, Pooya Saketi, Oscar Torrents Abad |
2021-05-18 |
$200,694,000 |
| 11005014 |
Optics formation using pick-up tools |
Patrick J. Hughes, Pooya Saketi, Oscar Torrents Abad |
2021-05-11 |
$263,216,000 |
| 10998215 |
Monitoring dry-etching of polymer layer for transferring semiconductor devices |
— |
2021-05-04 |
$254,432,000 |
