Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394748 | Substrate bonding | Kevin STRIBLEY, Reetta Griffiths, Ian Gordon Murray, Stuart Brodie | 2025-08-19 |
| 11735689 | Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Ali Sengül +1 more | 2023-08-22 |
| 10714464 | Method of selectively transferring LED die to a backplane using height controlled bonding structures | Anusha Pokhriyal, Timothy Gallagher | 2020-07-14 |
| 10693051 | Through backplane laser irradiation for die transfer | Anusha Pokhriyal | 2020-06-23 |
| 10553571 | Method of forming an array of a multi-device unit cell | Anusha Pokhriyal | 2020-02-04 |
| 10236447 | Selective die repair on a light emitting device assembly | Fariba Danesh, Frank Patterson, Timothy Gallagher | 2019-03-19 |
| 10193038 | Through backplane laser irradiation for die transfer | Anusha Pokhriyal | 2019-01-29 |
| 10177123 | Light emitting diode array on a backplane and method of making thereof | Nathan Gardner, Fredrick A. Kish, Jr., Miljenko Modric, Anusha Pokhriyal, Daniel Bryce Thompson +1 more | 2019-01-08 |
| 10128142 | Semiconductor structures including carrier wafers and attached device wafers, and methods of forming such semiconductor structures | Keith R. Cook | 2018-11-13 |
| 9893041 | Method of forming an array of a multi-device unit cell | Anusha Pokhriyal | 2018-02-13 |
| 9716023 | Methods for temporarily bonding a device wafer to a carrier wafer, and related assemblies | Neal Bowen, Andrew M. Bayless | 2017-07-25 |
| 9472518 | Semiconductor structures including carrier wafers and methods of using such semiconductor structures | Keith R. Cook | 2016-10-18 |
| 6908832 | In situ plasma wafer bonding method | Brian Roberds | 2005-06-21 |
| 6645828 | In situ plasma wafer bonding method | Brian Roberds | 2003-11-11 |
| 6534381 | Method for fabricating multi-layered substrates | Nathan W. Cheung, William G. En, Mikhail Korolik | 2003-03-18 |
| 6180496 | In situ plasma wafer bonding method | Brian Roberds | 2001-01-30 |