| 11735689 |
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating |
Daniel Brodoceanu, Oscar Torrents Abad, Zheng Sung Chio, Sharon N. Farrens, Ali Sengül +1 more |
2023-08-22 |
$320,369,000 |
| 11575069 |
Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers |
Daniel Brodoceanu, Oscar Torrents Abad, Zheng Sung Chio, Sharon Nanette Farrens, Ali Sengül |
2023-02-07 |
$324,710,000 |
| 11563142 |
Curing pre-applied and plasma-etched underfill via a laser |
Daniel Brodoceanu, Oscar Torrents Abad, Zheng Sung Chio, Ali Sengül |
2023-01-24 |
$131,221,000 |
| 11557692 |
Selectively bonding light-emitting devices via a pulsed laser |
Daniel Brodoceanu, Oscar Torrents Abad, Zheng Sung Chio, Sharon Nanette Farrens |
2023-01-17 |
$204,762,000 |
| 11424214 |
Hybrid interconnect for laser bonding using nanoporous metal tips |
Daniel Brodoceanu, Zheng Sung Chio, Oscar Torrents Abad, Ali Sengül |
2022-08-23 |
$154,256,000 |
| 11417792 |
Interconnect with nanotube fitting |
Ali Sengül, Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Tennyson Nguty |
2022-08-16 |
$251,777,000 |
| 11404600 |
Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers |
Daniel Brodoceanu, Zheng Sung Chio, Tennyson Nguty, Oscar Torrents Abad, Ali Sengül |
2022-08-02 |
$157,559,000 |
| 11391967 |
Transparent circuit boards with multilayered traces |
Karol Constantine Hatzilias, Paul A. Tchertchian, Robin Sharma, Christopher Yuan Ting Liao |
2022-07-19 |
$570,211,000 |
| 11374148 |
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating |
Daniel Brodoceanu, Oscar Torrents Abad, Zheng Sung Chio, Sharon Nanette Farrens, Ali Sengül +1 more |
2022-06-28 |
$203,238,000 |
| 11349053 |
Flexible interconnect using conductive adhesive |
Zheng Sung Chio, Daniel Brodoceanu, Ali Sengül, Oscar Torrents Abad, Pooya Saketi +3 more |
2022-05-31 |
$184,600,000 |
| 11296268 |
Magnetic clamping interconnects |
Ali Sengül, Oscar Torrents Abad, Daniel Brodoceanu, Zheng Sung Chio, Chao Kai Tung +2 more |
2022-04-05 |
$236,387,000 |
| 11276672 |
Bonding dummy electrodes of light emitting diode chip to substrate |
Oscar Torrents Abad, Daniel Brodoceanu, Pooya Saketi, Zheng Sung Chio, Ali Sengül |
2022-03-15 |
$320,007,000 |
| 11255529 |
Bonding corners of light emitting diode chip to substrate using laser |
Oscar Torrents Abad, Daniel Brodoceanu, Pooya Saketi, Zheng Sung Chio, Ali Sengül |
2022-02-22 |
$155,126,000 |
| 11239400 |
Curved pillar interconnects |
Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Ali Sengül, Pooya Saketi +4 more |
2022-02-01 |
$122,837,000 |
| 10162181 |
Display device with optics for brightness uniformity tuning having DOE optically coupled to receive light at central and peripheral regions |
James Randolph Webster, Steven John Robbins, Tuomas Vallius, Yarn Chee Poon |
2018-12-25 |
|
| 10088689 |
Light engine with lenticular microlenslet arrays |
Yarn Chee Poon, Steve Robbins, Angus Wu, James Randolph Webster, Richard Andrew Wall +4 more |
2018-10-02 |
$62,856,000 |
| 9726891 |
Left and right eye optical paths with shared optical element for head-mounted display device |
James Randolph Webster, Richard A. James, Steven John Robbins, Yarn Chee Poon, KengHui Lin +1 more |
2017-08-08 |
$27,985,000 |
