Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735689 | Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon N. Farrens +1 more | 2023-08-22 |
| 11677051 | Application of underfill via centrifugal force | Daniel Brodoceanu, Zheng Sung Chio, Chao Kai Tung, Oscar Torrents Abad | 2023-06-13 |
| 11417792 | Interconnect with nanotube fitting | Ali Sengül, Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu | 2022-08-16 |
| 11404600 | Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers | Jeb Wu, Daniel Brodoceanu, Zheng Sung Chio, Oscar Torrents Abad, Ali Sengül | 2022-08-02 |
| 11374148 | Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nanette Farrens +1 more | 2022-06-28 |
| 11349053 | Flexible interconnect using conductive adhesive | Zheng Sung Chio, Daniel Brodoceanu, Ali Sengül, Oscar Torrents Abad, Jeb Wu +3 more | 2022-05-31 |
| 11239400 | Curved pillar interconnects | Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Ali Sengül, Pooya Saketi +4 more | 2022-02-01 |
| 9307665 | Electrical component packaging | Michael Asis, Albertus Reijs, An XIAO | 2016-04-05 |