Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068443 | Forming conformable layer with flap on semiconductor devices | Tilman Zehender, Pooya Saketi, Karsten Moh | 2024-08-20 |
| 11756810 | Detection of force applied by pick-up tool for transferring semiconductor devices | Daniel Brodoceanu, Ali Sengül, Pooya Saketi | 2023-09-12 |
| 11670531 | Bridge pick-up head for transferring semiconductor devices | Daniel Brodoceanu, Ali Sengül, Pooya Saketi | 2023-06-06 |
| 11424214 | Hybrid interconnect for laser bonding using nanoporous metal tips | Daniel Brodoceanu, Zheng Sung Chio, Jeb Wu, Ali Sengül | 2022-08-23 |
| 11417792 | Interconnect with nanotube fitting | Ali Sengül, Zheng Sung Chio, Daniel Brodoceanu, Jeb Wu, Tennyson Nguty | 2022-08-16 |
| 11349053 | Flexible interconnect using conductive adhesive | Zheng Sung Chio, Daniel Brodoceanu, Ali Sengül, Jeb Wu, Pooya Saketi +3 more | 2022-05-31 |
| 11344971 | Microlens arrays for parallel micropatterning | Daniel Brodoceanu | 2022-05-31 |
| 11328942 | Liquid crystalline elastomer for pick and place of semiconductor devices | Thomas John Farrell Wallin, Yigit Mengue, Pooya Saketi, Ali Sengül, Nicholas Roy Corson +5 more | 2022-05-10 |
| 11296268 | Magnetic clamping interconnects | Ali Sengül, Daniel Brodoceanu, Zheng Sung Chio, Jeb Wu, Chao Kai Tung +2 more | 2022-04-05 |
| 11276672 | Bonding dummy electrodes of light emitting diode chip to substrate | Jeb Wu, Daniel Brodoceanu, Pooya Saketi, Zheng Sung Chio, Ali Sengül | 2022-03-15 |
| 11255529 | Bonding corners of light emitting diode chip to substrate using laser | Jeb Wu, Daniel Brodoceanu, Pooya Saketi, Zheng Sung Chio, Ali Sengül | 2022-02-22 |
| 11239400 | Curved pillar interconnects | Zheng Sung Chio, Daniel Brodoceanu, Ali Sengül, Pooya Saketi, Jeb Wu +4 more | 2022-02-01 |
| 11145797 | Forming conformable layer with flap on semiconductor devices | Tilman Zehender, Pooya Saketi, Karsten Moh | 2021-10-12 |
| 11107948 | Fluidic pick-up head for assembling light emitting diodes | Yigit Menguc, Pooya Saketi, Thomas John Farrell Wallin, Nicholas Roy Corson, Ali Sengül +5 more | 2021-08-31 |
| 11101159 | Pickup head with photocurable polymers for assembling light emitting diodes | Daniel Brodoceanu, Ali Sengül, Pooya Saketi | 2021-08-24 |
| 11011687 | Micro light emitting diode with remnants of fabrication substrate for structural support | Allan Pourchet, Pooya Saketi, Daniel Brodoceanu | 2021-05-18 |
| 11005014 | Optics formation using pick-up tools | Daniel Brodoceanu, Patrick J. Hughes, Pooya Saketi | 2021-05-11 |
| 10998286 | Laser-induced selective heating for microLED placement and bonding | Daniel Brodoceanu, Allan Pourchet | 2021-05-04 |
| 10998480 | Light-emitting structure alignment preservation in display fabrication | — | 2021-05-04 |
| 10989735 | Atomic force microscopy tips for interconnection | Ali Sengül, Zheng Sung Chio, Pooya Saketi, Daniel Brodoceanu | 2021-04-27 |
| 10964581 | Self-aligned adhesive layer formation in light-emitting structure fabrication | — | 2021-03-30 |
| 10964867 | Using underfill or flux to promote placing and parallel bonding of light emitting diodes | Daniel Brodoceanu, Thiago Martins Amaral, Pooya Saketi, Patrick J. Hughes, Alexander Udo May +1 more | 2021-03-30 |
| 10832933 | Dry-etching of carrier substrate for microLED microassembly | Daniel Brodoceanu | 2020-11-10 |
| 10818643 | Rigid pickup head with conformable layer | Daniel Brodoceanu, Ali Sengül, Pooya Saketi | 2020-10-27 |
| 10811575 | Laser lift-off masks | Daniel Brodoceanu, David Massoubre, James G. Small, Patrick J. Hughes | 2020-10-20 |