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Structure with improved adhesion |
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Forming conformable layer with flap on semiconductor devices |
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Using underfill or flux to promote placing and parallel bonding of light emitting diodes |
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Integrated elastomeric interface layer formation and singulation for light emitting diodes |
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| 10586725 |
Method for polymer-assisted chip transfer |
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| 10559486 |
Method for polymer-assisted chip transfer |
Daniel Brodoceanu, Pooya Saketi, Oscar Torrents Abad, Allan Pourchet, Patrick J. Hughes |
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| 10388516 |
Method for polymer-assisted chip transfer |
Oscar Torrents Abad, Pooya Saketi, Daniel Brodoceanu |
2019-08-20 |
| 10323324 |
Method for producing patterned metallic coatings |
Peter William de Oliveira, Tobias Dörr |
2019-06-18 |
| 10326040 |
Washable mold for conformable layer formation on semiconductor devices |
Oscar Torrents Abad, Tilman Zehender, Pooya Saketi |
2019-06-18 |
