Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068443 | Forming conformable layer with flap on semiconductor devices | Oscar Torrents Abad, Tilman Zehender, Pooya Saketi | 2024-08-20 |
| 12024656 | Moulded body comprising a structured surface for controlled adhesion | Lena Barnefske, Eduard Arzt, Fabian Rundel | 2024-07-02 |
| 11873849 | Shaped body having a structured surface for reversible adhesion | Eduard Arzt, Martin Schmitz | 2024-01-16 |
| 11787982 | Structure with improved adhesion | Eduard Arzt, René Hensel, Verena Nicola Tinnemann | 2023-10-17 |
| 11655396 | Double-sided reversible adhesive structure | Eduard Arzt, René Hensel | 2023-05-23 |
| 11145797 | Forming conformable layer with flap on semiconductor devices | Oscar Torrents Abad, Tilman Zehender, Pooya Saketi | 2021-10-12 |
| 10964867 | Using underfill or flux to promote placing and parallel bonding of light emitting diodes | Daniel Brodoceanu, Thiago Martins Amaral, Pooya Saketi, Patrick J. Hughes, Alexander Udo May +1 more | 2021-03-30 |
| 10941035 | Method for producing structured surfaces | Johannes H. M. Maurer, Tobias Kraus, Lola González-García, Beate Reiser, Ioannis Kanelidis +2 more | 2021-03-09 |
| 10910514 | Molded etch masks | Daniel Brodoceanu, David Massoubre | 2021-02-02 |
| 10822697 | Method for producing metal structures | Peter William de Oliveira, Eduard Arzt | 2020-11-03 |
| 10763135 | Integrated elastomeric interface layer formation and singulation for light emitting diodes | Pooya Saketi, Tilman Zehender | 2020-09-01 |
| 10586725 | Method for polymer-assisted chip transfer | Pooya Saketi, Oscar Torrents Abad, Allan Pourchet, Patrick J. Hughes, Daniel Brodoceanu | 2020-03-10 |
| 10559486 | Method for polymer-assisted chip transfer | Daniel Brodoceanu, Pooya Saketi, Oscar Torrents Abad, Allan Pourchet, Patrick J. Hughes | 2020-02-11 |
| 10388516 | Method for polymer-assisted chip transfer | Oscar Torrents Abad, Pooya Saketi, Daniel Brodoceanu | 2019-08-20 |
| 10323324 | Method for producing patterned metallic coatings | Peter William de Oliveira, Tobias Dörr | 2019-06-18 |
| 10326040 | Washable mold for conformable layer formation on semiconductor devices | Oscar Torrents Abad, Tilman Zehender, Pooya Saketi | 2019-06-18 |