Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068443 | Forming conformable layer with flap on semiconductor devices | Oscar Torrents Abad, Tilman Zehender, Karsten Moh | 2024-08-20 |
| 11756810 | Detection of force applied by pick-up tool for transferring semiconductor devices | Oscar Torrents Abad, Daniel Brodoceanu, Ali Sengül | 2023-09-12 |
| 11670531 | Bridge pick-up head for transferring semiconductor devices | Oscar Torrents Abad, Daniel Brodoceanu, Ali Sengül | 2023-06-06 |
| 11349053 | Flexible interconnect using conductive adhesive | Zheng Sung Chio, Daniel Brodoceanu, Ali Sengül, Oscar Torrents Abad, Jeb Wu +3 more | 2022-05-31 |
| 11328942 | Liquid crystalline elastomer for pick and place of semiconductor devices | Thomas John Farrell Wallin, Yigit Mengue, Ali Sengül, Nicholas Roy Corson, Katherine Healy +5 more | 2022-05-10 |
| 11276672 | Bonding dummy electrodes of light emitting diode chip to substrate | Jeb Wu, Oscar Torrents Abad, Daniel Brodoceanu, Zheng Sung Chio, Ali Sengül | 2022-03-15 |
| 11255529 | Bonding corners of light emitting diode chip to substrate using laser | Jeb Wu, Oscar Torrents Abad, Daniel Brodoceanu, Zheng Sung Chio, Ali Sengül | 2022-02-22 |
| 11239400 | Curved pillar interconnects | Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Ali Sengül, Jeb Wu +4 more | 2022-02-01 |
| 11234351 | Display fabrication microassembly system | — | 2022-01-25 |
| 11219151 | Pickup head with touch down sensor | — | 2022-01-04 |
| 11152533 | Etchant-accessible carrier substrate for display manufacture | Daniel Bryce Thompson, Daniel Brodoceanu | 2021-10-19 |
| 11145797 | Forming conformable layer with flap on semiconductor devices | Oscar Torrents Abad, Tilman Zehender, Karsten Moh | 2021-10-12 |
| 11107948 | Fluidic pick-up head for assembling light emitting diodes | Yigit Menguc, Thomas John Farrell Wallin, Nicholas Roy Corson, Ali Sengül, Katherine Healy +5 more | 2021-08-31 |
| 11101159 | Pickup head with photocurable polymers for assembling light emitting diodes | Daniel Brodoceanu, Oscar Torrents Abad, Ali Sengül | 2021-08-24 |
| 11076519 | Selective inking head for semiconductor devices | — | 2021-07-27 |
| 11011687 | Micro light emitting diode with remnants of fabrication substrate for structural support | Allan Pourchet, Daniel Brodoceanu, Oscar Torrents Abad | 2021-05-18 |
| 11005014 | Optics formation using pick-up tools | Daniel Brodoceanu, Patrick J. Hughes, Oscar Torrents Abad | 2021-05-11 |
| 10989735 | Atomic force microscopy tips for interconnection | Ali Sengül, Oscar Torrents Abad, Zheng Sung Chio, Daniel Brodoceanu | 2021-04-27 |
| 10984708 | Manufacture LED displays using temporary carriers | Allan Pourchet | 2021-04-20 |
| 10964867 | Using underfill or flux to promote placing and parallel bonding of light emitting diodes | Daniel Brodoceanu, Thiago Martins Amaral, Patrick J. Hughes, Alexander Udo May, Karsten Moh +1 more | 2021-03-30 |
| 10936061 | Eye tracking using reverse-biased light-emitting diode devices | Vincent Brennan, Patrick J. Hughes, Andrew John Ouderkirk, William Anthony Wall | 2021-03-02 |
| 10930529 | Formation of elastomeric layer on selective regions of light emitting device | Patrick J. Hughes, William Henry, Joseph O'Keeffe | 2021-02-23 |
| 10878733 | Assembly of semiconductor devices using multiple LED placement cycles | Padraig Hughes, Joseph O'Keeffe, Celine Claire Oyer, William Henry, David Massoubre | 2020-12-29 |
| 10818643 | Rigid pickup head with conformable layer | Daniel Brodoceanu, Oscar Torrents Abad, Ali Sengül | 2020-10-27 |
| 10775616 | Lenses integrated with micro-light emitting diodes | Andrew John Ouderkirk, Patrick J. Hughes, Robin Sharma, Celine Claire Oyer, James Ronald Bonar | 2020-09-15 |