| 11756810 |
Detection of force applied by pick-up tool for transferring semiconductor devices |
Oscar Torrents Abad, Daniel Brodoceanu, Pooya Saketi |
2023-09-12 |
| 11735689 |
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating |
Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon N. Farrens +1 more |
2023-08-22 |
| 11670531 |
Bridge pick-up head for transferring semiconductor devices |
Oscar Torrents Abad, Daniel Brodoceanu, Pooya Saketi |
2023-06-06 |
| 11575069 |
Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers |
Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nanette Farrens |
2023-02-07 |
| 11563142 |
Curing pre-applied and plasma-etched underfill via a laser |
Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio |
2023-01-24 |
| 11424214 |
Hybrid interconnect for laser bonding using nanoporous metal tips |
Daniel Brodoceanu, Zheng Sung Chio, Oscar Torrents Abad, Jeb Wu |
2022-08-23 |
| 11417792 |
Interconnect with nanotube fitting |
Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Tennyson Nguty |
2022-08-16 |
| 11404600 |
Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers |
Jeb Wu, Daniel Brodoceanu, Zheng Sung Chio, Tennyson Nguty, Oscar Torrents Abad |
2022-08-02 |
| 11374148 |
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating |
Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Sharon Nanette Farrens +1 more |
2022-06-28 |
| 11349053 |
Flexible interconnect using conductive adhesive |
Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Pooya Saketi +3 more |
2022-05-31 |
| 11328942 |
Liquid crystalline elastomer for pick and place of semiconductor devices |
Thomas John Farrell Wallin, Yigit Mengue, Pooya Saketi, Nicholas Roy Corson, Katherine Healy +5 more |
2022-05-10 |
| 11296268 |
Magnetic clamping interconnects |
Oscar Torrents Abad, Daniel Brodoceanu, Zheng Sung Chio, Jeb Wu, Chao Kai Tung +2 more |
2022-04-05 |
| 11276672 |
Bonding dummy electrodes of light emitting diode chip to substrate |
Jeb Wu, Oscar Torrents Abad, Daniel Brodoceanu, Pooya Saketi, Zheng Sung Chio |
2022-03-15 |
| 11255529 |
Bonding corners of light emitting diode chip to substrate using laser |
Jeb Wu, Oscar Torrents Abad, Daniel Brodoceanu, Pooya Saketi, Zheng Sung Chio |
2022-02-22 |
| 11239400 |
Curved pillar interconnects |
Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Pooya Saketi, Jeb Wu +4 more |
2022-02-01 |
| 11107948 |
Fluidic pick-up head for assembling light emitting diodes |
Yigit Menguc, Pooya Saketi, Thomas John Farrell Wallin, Nicholas Roy Corson, Katherine Healy +5 more |
2021-08-31 |
| 11101159 |
Pickup head with photocurable polymers for assembling light emitting diodes |
Daniel Brodoceanu, Oscar Torrents Abad, Pooya Saketi |
2021-08-24 |
| 10989735 |
Atomic force microscopy tips for interconnection |
Oscar Torrents Abad, Zheng Sung Chio, Pooya Saketi, Daniel Brodoceanu |
2021-04-27 |
| 10818643 |
Rigid pickup head with conformable layer |
Daniel Brodoceanu, Oscar Torrents Abad, Pooya Saketi |
2020-10-27 |
