Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11575069 | Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Ali Sengül | 2023-02-07 |
| 11557692 | Selectively bonding light-emitting devices via a pulsed laser | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio | 2023-01-17 |
| 11374148 | Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Ali Sengül +1 more | 2022-06-28 |