Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716023 | Methods for temporarily bonding a device wafer to a carrier wafer, and related assemblies | Sharon N. Farrens, Andrew M. Bayless | 2017-07-25 |
| 7372129 | Two die semiconductor assembly and system including same | — | 2008-05-13 |
| 7368320 | Method of fabricating a two die semiconductor assembly | — | 2008-05-06 |
| 7021520 | Stacked chip connection using stand off stitch bonding | — | 2006-04-04 |