Issued Patents All Time
Showing 126–150 of 354 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8198729 | Connection between a semiconductor chip and a circuit component with a large contact area | Chiu-Ming Chou, Chien-Kang Chou | 2012-06-12 |
| 8193555 | Image and light sensor chip packages | Jin-Yuan Lee | 2012-06-05 |
| 8187965 | Wirebond pad for semiconductor chip or wafer | Michael Chen, Chien-Kang Chou, Mark Chou | 2012-05-29 |
| 8188603 | Post passivation interconnection schemes on top of IC chip | Jin-Yuan Lee | 2012-05-29 |
| 8178435 | High performance system-on-chip inductor using post passivation process | — | 2012-05-15 |
| 8168527 | Semiconductor chip and method for fabricating the same | Chiu-Ming Chou | 2012-05-01 |
| 8164171 | System-in packages | Jin-Yuan Lee | 2012-04-24 |
| 8159074 | Chip structure | Chiu-Ming Chou, Chien-Kang Chou, Hsin-Jung Lo | 2012-04-17 |
| 8159070 | Chip packages | Jin-Yuan Lee | 2012-04-17 |
| 8158508 | Structure and manufacturing method of a chip scale package | Ming-Ta Lei, Chuen-Jye Lin | 2012-04-17 |
| 8148822 | Bonding pad on IC substrate and method for making the same | Hsin-Jung Lo, Chiu-Ming Chou, Chien-Kang Chou, Ke-Hung Chen | 2012-04-03 |
| 8148806 | Multiple chips bonded to packaging structure with low noise and multiple selectable functions | Bryan Peng | 2012-04-03 |
| 8138079 | Method of wire bonding over active area of a semiconductor circuit | Jin-Yuan Lee, Ying-Chih Chen | 2012-03-20 |
| 8129265 | High performance system-on-chip discrete components using post passivation process | — | 2012-03-06 |
| 8124446 | Structure of high performance combo chip and processing method | Jin-Yuan Lee | 2012-02-28 |
| 8120181 | Post passivation interconnection process and structures | Chiu-Ming Chou, Chien-Kang Chou | 2012-02-21 |
| 8119446 | Integrated chip package structure using metal substrate and method of manufacturing the same | Jin-Yuan Lee, Ching-Cheng Huang | 2012-02-21 |
| 8107311 | Software programmable multiple function integrated circuit module | — | 2012-01-31 |
| 8089155 | High performance system-on-chip discrete components using post passivation process | — | 2012-01-03 |
| 8072070 | Low fabrication cost, fine pitch and high reliability solder bump | Jin-Yuan Lee, Ching-Cheng Huang | 2011-12-06 |
| 8067837 | Metallization structure over passivation layer for IC chip | — | 2011-11-29 |
| 8044475 | Chip package | Shih-Hsiung Lin, Hsin-Jung Lo | 2011-10-25 |
| 8035227 | Top layers of metal for high performance IC's | Jin-Yuan Lee | 2011-10-11 |
| 8030775 | Wirebond over post passivation thick metal | — | 2011-10-04 |
| 8026588 | Method of wire bonding over active area of a semiconductor circuit | Jin-Yuan Lee, Ying-Chih Chen | 2011-09-27 |