Issued Patents All Time
Showing 76–100 of 281 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8482127 | Post passivation interconnection schemes on top of IC chip | Mou-Shiung Lin | 2013-07-09 |
| 8481418 | Low fabrication cost, high performance, high reliability chip scale package | Ming-Ta Lei, Ching-Cheng Huang, Chuen-Jye Lin | 2013-07-09 |
| 8471388 | Integrated circuit and method for fabricating the same | Mou-Shiung Lin | 2013-06-25 |
| 8471361 | Integrated chip package structure using organic substrate and method of manufacturing the same | Mou-Shiung Lin, Ching-Cheng Huang | 2013-06-25 |
| 8461686 | Post passivation interconnection schemes on top of IC chip | Mou-Shiung Lin | 2013-06-11 |
| 8461679 | Method for fabricating circuit component | Chien-Kang Chou, Shih-Hsiung Lin, Hsi-Shan Kuo | 2013-06-11 |
| 8456856 | Integrated circuit chip using top post-passivation technology and bottom structure technology | Mou-Shiung Lin, Hsin-Jung Lo, Ping-Jung Yang, Te-Sheng Liu | 2013-06-04 |
| 8435883 | Post passivation interconnection schemes on top of IC chips | Mou-Shiung Lin | 2013-05-07 |
| 8426982 | Structure and manufacturing method of chip scale package | Ching-Cheng Huang, Mou-Shiung Lin | 2013-04-23 |
| 8421290 | Assembly of driving device for brushless motor of air-conditioner | Chin-Hui Lin | 2013-04-16 |
| 8421227 | Semiconductor chip structure | Mou-Shiung Lin | 2013-04-16 |
| 8420520 | Non-cyanide gold electroplating for fine-line gold traces and gold pads | Mou-Shiung Lin | 2013-04-16 |
| 8384508 | Method for making high-performance RF integrated circuits | Mou-Shiung Lin | 2013-02-26 |
| 8373202 | Integrated circuit chips with fine-line metal and over-passivation metal | Mou-Shiung Lin, Chien-Kang Chou | 2013-02-12 |
| 8368213 | Low fabrication cost, fine pitch and high reliability solder bump | Mou-Shiung Lin, Ching-Cheng Huang | 2013-02-05 |
| 8368204 | Chip structure and process for forming the same | Mou-Shiung Lin, Ching-Cheng Huang | 2013-02-05 |
| 8362588 | Semiconductor chip with coil element over passivation layer | Wen-Chieh Lee, Mou-Shiung Lin, Chien-Kang Chou, Yi-Cheng Liu, Chiu-Ming Chou | 2013-01-29 |
| 8350386 | Top layers of metal for high performance IC's | Mou-Shiung Lin | 2013-01-08 |
| 8334588 | Circuit component with conductive layer structure | Eric Lin | 2012-12-18 |
| RE43674 | Post passivation metal scheme for high-performance integrated circuit devices | Mou-Shiung Lin, Ming-Ta Lei, Ching-Cheng Huang | 2012-09-18 |
| 8211791 | Method for fabricating circuitry component | Mou-Shiung Lin, Ching-Cheng Huang | 2012-07-03 |
| 8193636 | Chip assembly with interconnection by metal bump | Hsin-Jung Lo | 2012-06-05 |
| 8193555 | Image and light sensor chip packages | Mou-Shiung Lin | 2012-06-05 |
| 8188603 | Post passivation interconnection schemes on top of IC chip | Mou-Shiung Lin | 2012-05-29 |
| 8178967 | Low fabrication cost, high performance, high reliability chip scale package | Ming-Ta Lei, Ching-Cheng Huang, Chuen-Jye Lin | 2012-05-15 |