Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8890336 | Cylindrical bonding structure and method of manufacture | Jin-Yuan Lee, Chien-Kang Chou, Shih-Hsiung Lin | 2014-11-18 |
| 8461679 | Method for fabricating circuit component | Jin-Yuan Lee, Chien-Kang Chou, Shih-Hsiung Lin | 2013-06-11 |
| 7960270 | Method for fabricating circuit component | Jin-Yuan Lee, Chien-Kang Chou, Shih-Hsiung Lin | 2011-06-14 |
| 7208834 | Bonding structure with pillar and cap | Jin-Yuan Lee, Chien-Kang Chou, Shih-Hsiung Lin | 2007-04-24 |
| 6784087 | Method of fabricating cylindrical bonding structure | Jin-Yuan Lee, Chien-Kang Chou, Shih-Hsiung Lin | 2004-08-31 |
| 6032704 | Method and apparatus for storing wafers without moisture absorption | Hsin-Chieh Huang, Yeh-Jye Wann | 2000-03-07 |