Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176278 | 3D chip package based on vertical-through-via connector | Mou-Shiung Lin, Jin-Yuan Lee, Hsin-Jung Lo, Chiu-Ming Chou | 2024-12-24 |
| 12062618 | Chip package | — | 2024-08-13 |
| 11894306 | Chip package | — | 2024-02-06 |
| 11816844 | Method for measuring angular velocity and angular acceleration based on monocular vision | Ming Yang, Chenguang Cai, Zhihua Liu, Qi Lyu, Wenfeng Liu | 2023-11-14 |
| 11754595 | Method for calibrating linear vibration and angular vibration based on monocular vision | Chenguang Cai, Ming Yang, Zhihua Liu, Qi Lyu, Wenfeng Liu | 2023-09-12 |
| 11538763 | Chip package | — | 2022-12-27 |
| 11107768 | Chip package | — | 2021-08-31 |
| 10622310 | Method for fabricating glass substrate package | — | 2020-04-14 |
| 10583580 | Sand aerated concrete panel embedded with wire box and wire conduit and method for preparing same | Yang Liu, Junqi Li, Zhenfeng Liu, Xiaoyu Xue, Tao Liu +1 more | 2020-03-10 |
| 10453819 | Method for fabricating glass substrate package | — | 2019-10-22 |
| 10096565 | Method for fabricating glass substrate package | — | 2018-10-09 |
| 9951435 | Coating packaged chamber parts for semiconductor plasma apparatus | Xiaoming He, Lei Wan, Zhaoyang Xu, Hanting Zhang | 2018-04-24 |
| 9841214 | Passive organic working fluid ejector refrigeration method | Yiwu Weng, Xiaojing Lv, Yuzhang Wang, Lei Tang, Qianqian Zhang | 2017-12-12 |
| 9617633 | Coating packaged chamber parts for semiconductor plasma apparatus | Xiaoming He, Lei Wan, Zhaoyang Xu, Hanting Zhang | 2017-04-11 |
| 9612615 | Integrated circuit chip using top post-passivation technology and bottom structure technology | Mou-Shiung Lin, Jin-Yuan Lee, Hsin-Jung Lo, Te-Sheng Liu | 2017-04-04 |
| 9615453 | Method for fabricating glass substrate package | — | 2017-04-04 |
| 8837872 | Waveguide structures for signal and/or power transmission in a semiconductor device | Hsin-Jung Lo, Te-Sheng Liu | 2014-09-16 |
| 8456856 | Integrated circuit chip using top post-passivation technology and bottom structure technology | Mou-Shiung Lin, Jin-Yuan Lee, Hsin-Jung Lo, Te-Sheng Liu | 2013-06-04 |
| 8431977 | Wafer level processing method and structure to manufacture semiconductor chip | — | 2013-04-30 |