Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Ping-Jung Yang — 19 Patents

UNUnknown: 8 patents #1,262 of 83,584Top 2%
HUHuizhou University: 2 patents #8 of 94Top 9%
AEAdvanced Micro-Fabrication Equipment: 2 patents #12 of 61Top 20%
NCNational Institute Of Metrology, China: 2 patents #18 of 98Top 20%
MEMegica: 2 patents #22 of 32Top 70%
Qualcomm: 2 patents #5,657 of 12,104Top 50%
ICIcometrue Company: 1 patents #3 of 5Top 60%
Shanghai, CN: #466 of 19,267 inventorsTop 3%
Overall (All Time): #229,345 of 4,157,543Top 6%
19 Patents All Time
Ping-Jung Yang has been granted 19 US patents while listed as an inventor at Unknown. The first was granted in 2013 and the most recent in December 2024. Ping-Jung Yang ranks #229,345 of 4,157,543 US inventors in our database (top 5.5%). Patent records list Ping-Jung Yang in Shanghai, CN.

Patents per Year

Patents granted per year, 2013 to 2024Bar chart with a peak of 4 patents in 2017.peak 42013: 2 patents20132014: 1 patents20142017: 4 patents20172018: 2 patents20182019: 1 patents20192020: 2 patents20202021: 1 patents20212022: 1 patents20222023: 2 patents20232024: 3 patents2024

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12176278 3D chip package based on vertical-through-via connector Mou-Shiung Lin, Jin-Yuan Lee, Hsin-Jung Lo, Chiu-Ming Chou 2024-12-24
12062618 Chip package — 2024-08-13
11894306 Chip package — 2024-02-06
11816844 Method for measuring angular velocity and angular acceleration based on monocular vision Ming Yang, Chenguang Cai, Zhihua Liu, Qi Lyu, Wenfeng Liu 2023-11-14
11754595 Method for calibrating linear vibration and angular vibration based on monocular vision Chenguang Cai, Ming Yang, Zhihua Liu, Qi Lyu, Wenfeng Liu 2023-09-12
11538763 Chip package — 2022-12-27
11107768 Chip package — 2021-08-31
10622310 Method for fabricating glass substrate package — 2020-04-14
10583580 Sand aerated concrete panel embedded with wire box and wire conduit and method for preparing same Yang Liu, Junqi Li, Zhenfeng Liu, Xiaoyu Xue, Tao Liu +1 more 2020-03-10
10453819 Method for fabricating glass substrate package — 2019-10-22
10096565 Method for fabricating glass substrate package — 2018-10-09
9951435 Coating packaged chamber parts for semiconductor plasma apparatus Xiaoming He, Lei Wan, Zhaoyang Xu, Hanting Zhang 2018-04-24
9841214 Passive organic working fluid ejector refrigeration method Yiwu Weng, Xiaojing Lv, Yuzhang Wang, Lei Tang, Qianqian Zhang 2017-12-12
9617633 Coating packaged chamber parts for semiconductor plasma apparatus Xiaoming He, Lei Wan, Zhaoyang Xu, Hanting Zhang 2017-04-11
9612615 Integrated circuit chip using top post-passivation technology and bottom structure technology Mou-Shiung Lin, Jin-Yuan Lee, Hsin-Jung Lo, Te-Sheng Liu 2017-04-04 $11,369,000
9615453 Method for fabricating glass substrate package — 2017-04-04
8837872 Waveguide structures for signal and/or power transmission in a semiconductor device Hsin-Jung Lo, Te-Sheng Liu 2014-09-16 $6,243,000
8456856 Integrated circuit chip using top post-passivation technology and bottom structure technology Mou-Shiung Lin, Jin-Yuan Lee, Hsin-Jung Lo, Te-Sheng Liu 2013-06-04
8431977 Wafer level processing method and structure to manufacture semiconductor chip — 2013-04-30

Frequent Collaborators

Hsin-Jung Lo4 shared
Mou-Shiung Lin3 shared
Jin-Yuan Lee3 shared
Te-Sheng Liu3 shared
Wenfeng Liu2 shared
Ming Yang2 shared

Nearby-Ranked Inventors

Vlastimil Kunc19
Nikolaj Maj Bentsen19
Vladimir Zhukov19
Remi Geraud19
Stephen Kaes19
Adeeti V. Ullal19
Ichiro Hayashi19
Kazuhiko Ueno19
Lei S. Qi19