Issued Patents All Time
Showing 51–75 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6282358 | On-chip single layer horizontal deflecting waveguide and damascene method of fabricating the same | Verne C. Hornbeck | 2001-08-28 |
| 6241847 | Method and apparatus for detecting a polishing endpoint based upon infrared signals | David W. Daniel, John Gregory | 2001-06-05 |
| 6225154 | Bonding of silicon wafers | — | 2001-05-01 |
| 6211096 | Tunable dielectric constant oxide and method of manufacture | Dim-Lee Kwong | 2001-04-03 |
| 6208029 | Integrated circuit device with reduced cross talk | Kenneth P. Fuchs, Gayle W. Miller, Samuel C. Gioia | 2001-03-27 |
| 6201253 | Method and apparatus for detecting a planarized outer layer of a semiconductor wafer with a confocal optical system | David W. Daniel, John Gregory | 2001-03-13 |
| 6177305 | Fabrication of metal-insulator-metal capacitive structures | Verne Hornback, Newell E. Chiesl | 2001-01-23 |
| 6168502 | Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus | John Gregory | 2001-01-02 |
| 6136662 | Semiconductor wafer having a layer-to-layer alignment mark and method for fabricating the same | Curtis C. Hainds, Charles W. Jurgensen, Brian R. Lee | 2000-10-24 |
| 6121147 | Apparatus and method of detecting a polishing endpoint layer of a semiconductor wafer which includes a metallic reporting substance | David W. Daniel, John Gregory | 2000-09-19 |
| 6115233 | Integrated circuit device having a capacitor with the dielectric peripheral region being greater than the dielectric central region | John J. Seliskar, John Gregory, James P. Yakura, Dim-Lee Kwong | 2000-09-05 |
| 6077783 | Method and apparatus for detecting a polishing endpoint based upon heat conducted through a semiconductor wafer | David W. Daniel, Michael F. Chisholm | 2000-06-20 |
| 6071562 | Process for depositing titanium nitride films | Verne Hornback | 2000-06-06 |
| 6071817 | Isolation method utilizing a high pressure oxidation | Kenneth P. Fuchs | 2000-06-06 |
| 6010963 | Global planarization using SOG and CMP | Kenneth P. Fuchs | 2000-01-04 |
| 5963828 | Method for tungsten nucleation from WF.sub.6 using titanium as a reducing agent | Verne Hornback, Ramanath Ganapathiraman, Leslie H. Allen | 1999-10-05 |
| 5868608 | Subsonic to supersonic and ultrasonic conditioning of a polishing pad in a chemical mechanical polishing apparatus | John Gregory | 1999-02-09 |
| 5861055 | Polishing composition for CMP operations | William J. Crosby, James A. Maiolo | 1999-01-19 |
| 5728626 | Spin-on conductor process for integrated circuits | Steven S. Lee | 1998-03-17 |
| 5665845 | Electronic device with a spin-on glass dielectric layer | — | 1997-09-09 |
| 5645736 | Method for polishing a wafer | — | 1997-07-08 |
| 5576224 | Method for manufacturing a monitor element | James P. Yakura, Richard K. Cole, Matthew Von Thun, Crystal J. Hass | 1996-11-19 |
| 5527872 | Electronic device with a spin-on glass dielectric layer | — | 1996-06-18 |
| 5472488 | Coating solution for forming glassy layers | — | 1995-12-05 |
| 5466614 | Structure and method for remotely measuring process data | James P. Yakura, Richard K. Cole, Matthew Von Thun, Crystal J. Hass | 1995-11-14 |