| 11037816 |
Transistor device with sinker contacts and methods for manufacturing the same |
Hong-Seon Yang, Yufei Xiong, Yunlong Liu |
2021-06-15 |
| 9640953 |
Switchgear motor operator |
Albert Beyginian, Terry Kerr |
2017-05-02 |
| 6653717 |
Enhancement in throughput and planarity during CMP using a dielectric stack containing an HDP oxide |
Manoj Kumar Jain |
2003-11-25 |
| 6586839 |
Approach to structurally reinforcing the mechanical performance of silicon level interconnect layers |
Darvin R. Edwards, Gregory B. Hotchkiss, Reynaldo Rincon, Viswanathan Sundararaman |
2003-07-01 |
| 6495907 |
Conductor reticulation for improved device planarity |
Manoj Kumar Jain |
2002-12-17 |
| 6268224 |
Method and apparatus for detecting an ion-implanted polishing endpoint layer within a semiconductor wafer |
Gayle W. Miller |
2001-07-31 |
| 6235590 |
Fabrication of differential gate oxide thicknesses on a single integrated circuit chip |
David W. Daniel, Dianne G. Pinello |
2001-05-22 |
| 6077783 |
Method and apparatus for detecting a polishing endpoint based upon heat conducted through a semiconductor wafer |
Derryl D. J. Allman, David W. Daniel |
2000-06-20 |
| 5906754 |
Apparatus integrating pad conditioner with a wafer carrier for chemical-mechanical polishing applications |
Andrew T. Appel |
1999-05-25 |
| 5755979 |
Application of semiconductor IC fabrication techniques to the manufacturing of a conditioning head for pad conditioning during chemical-mechanical polish |
Andrew T. Appel |
1998-05-26 |
| 5686356 |
Conductor reticulation for improved device planarity |
Manoj Kumar Jain |
1997-11-11 |
| 5595527 |
Application of semiconductor IC fabrication techniques to the manufacturing of a conditioning head for pad conditioning during chemical-mechanical polish |
Andrew T. Appel |
1997-01-21 |
| 5560802 |
Selective CMP of in-situ deposited multilayer films to enhance nonplanar step height reduction |
— |
1996-10-01 |
| 5536202 |
Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish |
Andrew T. Appel |
1996-07-16 |
| 5522965 |
Compact system and method for chemical-mechanical polishing utilizing energy coupled to the polishing pad/water interface |
Andrew T. Appel |
1996-06-04 |
| 5462882 |
Masked radiant anneal diffusion method |
David Forehand |
1995-10-31 |
| 5420445 |
Aluminum-masked and radiantly-annealed group II-IV diffused region |
David Forehand |
1995-05-30 |
