| 7977230 |
Rectangular contact used as a low voltage fuse element |
— |
2011-07-12 |
| 7442626 |
Rectangular contact used as a low voltage fuse element |
— |
2008-10-28 |
| 6774457 |
Rectangular contact used as a low voltage fuse element |
— |
2004-08-10 |
| 6653681 |
Additional capacitance for MIM capacitors with no additional processing |
— |
2003-11-25 |
| 6150669 |
Combination test structures for in-situ measurements during fabrication of semiconductor devices |
Mahalingam Nandakumar, Greg Baldwin |
2000-11-21 |
| 6030864 |
Vertical NPN transistor for 0.35 micrometer node CMOS logic technology |
Frank Scott Johnson |
2000-02-29 |
| 5906754 |
Apparatus integrating pad conditioner with a wafer carrier for chemical-mechanical polishing applications |
Michael F. Chisholm |
1999-05-25 |
| 5755979 |
Application of semiconductor IC fabrication techniques to the manufacturing of a conditioning head for pad conditioning during chemical-mechanical polish |
Michael F. Chisholm |
1998-05-26 |
| 5605861 |
Thin polysilicon doping by diffusion from a doped silicon dioxide film |
— |
1997-02-25 |
| 5595527 |
Application of semiconductor IC fabrication techniques to the manufacturing of a conditioning head for pad conditioning during chemical-mechanical polish |
Michael F. Chisholm |
1997-01-21 |
| 5595922 |
Process for thickening selective gate oxide regions |
Howard L. Tigelaar, Bert R. Riemenschneider, Richard A. Chapman |
1997-01-21 |
| 5536202 |
Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish |
Michael F. Chisholm |
1996-07-16 |
| 5522965 |
Compact system and method for chemical-mechanical polishing utilizing energy coupled to the polishing pad/water interface |
Michael F. Chisholm |
1996-06-04 |
| 5088036 |
Real time, concurrent garbage collection system and method |
John R. Ellis, Kai Li |
1992-02-11 |