Issued Patents All Time
Showing 26–50 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6576544 | Local interconnect | James R. Hightower, Phonesavanh Saopraseuth | 2003-06-10 |
| 6570221 | Bonding of silicon wafers | — | 2003-05-27 |
| 6566186 | Capacitor with stoichiometrically adjusted dielectric and method of fabricating same | Nabil Mansour, Ponce Saopraseuth | 2003-05-20 |
| 6562700 | Process for removal of resist mask over low k carbon-doped silicon oxide dielectric material of an integrated circuit structure, and removal of residues from via etch and resist mask removal | Sam Gu, David Pritchard, Ponce Saopraseuth, Steve Reder | 2003-05-13 |
| 6562735 | Control of reaction rate in formation of low k carbon-containing silicon oxide dielectric material using organosilane, unsubstituted silane, and hydrogen peroxide reactants | Ponce Saopraseuth | 2003-05-13 |
| 6541383 | Apparatus and method for planarizing the surface of a semiconductor wafer | John Gregory | 2003-04-01 |
| 6528389 | Substrate planarization with a chemical mechanical polishing stop layer | John Gregory | 2003-03-04 |
| 6524926 | Metal-insulator-metal capacitor formed by damascene processes between metal interconnect layers and method of forming same | John Gregory | 2003-02-25 |
| 6522005 | Integrated circuit device comprising low dielectric constant material for reduced cross talk | Kenneth P. Fuchs, Gayle W. Miller, Samuel C. Gioia | 2003-02-18 |
| 6522006 | Low dielectric constant material in integrated circuit | Kenneth P. Fuchs, Gayle W. Miller, Samuel C. Gioia | 2003-02-18 |
| 6504250 | Integrated circuit device with reduced cross talk | Kenneth P. Fuchs, Gayle W. Miller, Samuel C. Gioia | 2003-01-07 |
| 6504202 | Interconnect-embedded metal-insulator-metal capacitor | Kenneth P. Fuchs | 2003-01-07 |
| 6504249 | Integrated circuit device with reduced cross talk | Kenneth P. Fuchs, Gayle W. Miller, Samuel C. Gioia | 2003-01-07 |
| 6479857 | Capacitor having a tantalum lower electrode and method of forming the same | — | 2002-11-12 |
| 6480643 | On-chip multiple layer vertically transitioning optical waveguide and damascene method of fabricating the same | Verne C. Hornbeck | 2002-11-12 |
| 6448653 | Method for using low dielectric constant material in integrated circuit fabrication | Kenneth P. Fuchs, Gayle W. Miller, Samuel C. Gioia | 2002-09-10 |
| 6445479 | Electronically controlled optically-active device array for high-speed receiving and transmitting of fiber optic signals | Verne Hornback | 2002-09-03 |
| 6387284 | On-chip single layer horizontal deflecting waveguide and damascene method of fabricating the same | Verne C. Hornbeck | 2002-05-14 |
| 6354908 | Method and apparatus for detecting a planarized outer layer of a semiconductor wafer with a confocal optical system | David W. Daniel, John Gregory | 2002-03-12 |
| 6342734 | Interconnect-integrated metal-insulator-metal capacitor and method of fabricating same | John Quillian Walker, II, Verne Hornback, Todd A. Randazzo | 2002-01-29 |
| 6341056 | Capacitor with multiple-component dielectric and method of fabricating same | Brian Bystedt | 2002-01-22 |
| 6324313 | On-chip multiple layer vertically transitioning optical waveguide and damascene method of fabricating the same | Verne C. Hornbeck | 2001-11-27 |
| 6316276 | Apparatus and method of planarizing a semiconductor wafer that includes a first reflective substance and a second reflective substance | John Gregory | 2001-11-13 |
| 6288454 | Semiconductor wafer having a layer-to-layer alignment mark and method for fabricating the same | Curtis C. Hainds, Charles W. Jurgensen, Brian R. Lee | 2001-09-11 |
| 6284586 | Integrated circuit device and method of making the same using chemical mechanical polishing to remove material in two layers following masking | John J. Seliskar, John Gregory, James P. Yakura, Dim-Lee Kwong | 2001-09-04 |