Issued Patents All Time
Showing 26–50 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9142416 | Process to reduce nodule formation in electroless plating | Nanhai Li, Xiaomin Bin, Yaxin Wang, Marina Polyanskaya, Novy Tjokro | 2015-09-22 |
| 9128493 | Method and apparatus for plating solution analysis and control | Ron Rulkens, Nanhai Li, Aman Jain, Darin Birtwhistle, Chee Leong Raymond CHAN | 2015-09-08 |
| 9058975 | Cleaning solution formulations for substrates | Fritz Redeker | 2015-06-16 |
| 9048088 | Processes and solutions for substrate cleaning and electroless deposition | Nanhai Li | 2015-06-02 |
| 9029258 | Through silicon via metallization | Praveen Nalla, Novy Tjokro, Seshasayee Varadarajan | 2015-05-12 |
| 9006893 | Devices for metallization | William T. Lee, Fritz Redeker | 2015-04-14 |
| 8980746 | Adhesion layer for through silicon via metallization | — | 2015-03-17 |
| 8970027 | Metallization mixtures and electronic devices | Fritz Redeker | 2015-03-03 |
| 8921296 | Post deposition wafer cleaning formulation | — | 2014-12-30 |
| 8906446 | Apparatus and method for electroless deposition of materials on semiconductor substrates | Igor Ivanov, Jonathan Weiguo Zhang | 2014-12-09 |
| 8895441 | Methods and materials for anchoring gapfill metals | — | 2014-11-25 |
| 8808791 | Method for strengthening adhesion between dielectric layers formed adjacent to metal layers | Igor Ivanov, Weiguo Zhang | 2014-08-19 |
| 8790465 | Post-deposition cleaning methods for substrates with cap layers | Shijian Li, Tiruchirapalli Arunagiri, William Thie | 2014-07-29 |
| 8736055 | Methods and layers for metallization | Nalla Praveen | 2014-05-27 |
| 8632628 | Solutions and methods for metal deposition | — | 2014-01-21 |
| 8603913 | Porous dielectrics K value restoration by thermal treatment and or solvent treatment | Nanhai Li, William Thie, Novy Tjokro, Yaxin Wang | 2013-12-10 |
| 8586133 | Method for strengthening adhesion between dielectric layers formed adjacent to metal layers | Igor Ivanov, Weiguo Zhang | 2013-11-19 |
| 8551575 | Methods and solutions for preventing the formation of metal particulate defect matter upon a substrate after a plating process | Shijian Li, Tiruchirapalli Arunagiri | 2013-10-08 |
| 8518815 | Methods, devices, and materials for metallization | William T. Lee, Fritz Redeker | 2013-08-27 |
| 8518826 | Metallization processes, mixtures, and electronic devices | Fritz Redeker | 2013-08-27 |
| 8404626 | Post-deposition cleaning methods and formulations for substrates with cap layers | Shijian Li, Tiruchirapalli Arunagiri, William Thie | 2013-03-26 |
| 8328919 | Electroless deposition solutions and process control | — | 2012-12-11 |
| 8128987 | Apparatus and method for electroless deposition of materials on semiconductor substrates | Igor Ivanov, Jonathan Weiguo Zhang | 2012-03-06 |
| 7913644 | Electroless deposition system | Ron Rulkens, Robert Tas, Shashank Ravindra Kulkarni, Nancy E. Gilbert | 2011-03-29 |
| 7883739 | Method for strengthening adhesion between dielectric layers formed adjacent to metal layers | Igor Ivanov, Weiguo Zhang | 2011-02-08 |