Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6059920 | Semiconductor device polishing apparatus having improved polishing liquid supplying apparatus, and polishing liquid supplying method | Haruki Nojo, Kiyotaka Kawashima | 2000-05-09 |
| 5792326 | Method and apparatus for generating ozone and methods of its use | Minoru Harada, Ryoichi Shinjo, Manabu Tsujimura, Kunihiro Miyazaki, Naruhiko Kaji +1 more | 1998-08-11 |
| 5794114 | Ozonizer | Minoru Harada, Ryoichi Shinjo, Manabu Tsujimura, Kunihiro Miyazaki, Naruhiko Kaji | 1998-08-11 |
| 5775980 | Polishing method and polishing apparatus | Yasutaka Sasaki, Mie Matsuo, Junichi Wada, Nobuo Hayasaka, Hiroyuki Yano +1 more | 1998-07-07 |
| 5702673 | Ozone generating apparatus | Naruhiko Kaji, Yutaka Nakano, Minoru Harada, Ryoichi Shinjo, Manabu Tsujimura | 1997-12-30 |
| 5664989 | Polishing pad, polishing apparatus and polishing method | Hisashi Kaneko, Nobuo Hayasaka, Takeshi Nishioka, Yoshikuni Tateyama, Yutaka Nakano +1 more | 1997-09-09 |
| 5641581 | Semiconductor device | Yukio Nishiyama, Nobuo Hayasaka, Haruo Okano, Riichirou Aoki, Takahito Nagamatsu +3 more | 1997-06-24 |
| 5632868 | Method and apparatus for generating ozone and methods of its use | Minoru Harada, Ryoichi Shinjo, Manabu Tsujimura, Kunihiro Miyazaki, Naruhiko Kaji +1 more | 1997-05-27 |
| 5620925 | Method of manufacturing semiconductor device using a hagolen plasma treatment step | Hitoshi Itoh, Takashi Endo, Tohru Watanabe | 1997-04-15 |
| 5607718 | Polishing method and polishing apparatus | Yasutaka Sasaki, Mie Matsuo, Junichi Wada, Nobuo Hayasaka, Hiroyuki Yano +1 more | 1997-03-04 |
| 5429995 | Method of manufacturing silicon oxide film containing fluorine | Yukio Nishiyama, Nobuo Hayasaka, Haruo Okano, Riichirou Aoki, Takahito Nagamatsu +3 more | 1995-07-04 |
| 5119761 | Substrate heating apparatus for forming thin films on substrate surface | — | 1992-06-09 |
| 5071789 | Method for forming a metal electrical connector to a surface of a semiconductor device adjacent a sidewall of insulation material with metal creep-up extending up that sidewall, and related device | — | 1991-12-10 |