NY

Naoki Yasuda

KT Kabushiki Kaisha Toshiba: 63 patents #215 of 21,451Top 2%
Mitsubishi Electric: 22 patents #842 of 25,717Top 4%
Toshiba Memory: 8 patents #210 of 1,971Top 15%
AC Ajinomoto Co.: 6 patents #301 of 2,190Top 15%
FI Fujifilm Business Innovation: 2 patents #2,833 of 5,238Top 55%
Kioxia: 2 patents #693 of 1,813Top 40%
SH Shimadzu: 2 patents #805 of 2,007Top 45%
RT Renesas Technology: 1 patents #1,991 of 3,337Top 60%
Fujitsu Limited: 1 patents #14,843 of 24,456Top 65%
NC Nippon Shokubai Co.: 1 patents #656 of 1,108Top 60%
RE Renesas Electronics: 1 patents #2,739 of 4,529Top 65%
📍 Yokohama, NJ: #3 of 31 inventorsTop 10%
Overall (All Time): #12,193 of 4,157,543Top 1%
109
Patents All Time

Issued Patents All Time

Showing 101–109 of 109 patents

Patent #TitleCo-InventorsDate
6319853 Method of manufacturing a semiconductor device using a minute resist pattern, and a semiconductor device manufactured thereby Takeo Ishibashi, Toshiyuki Toyoshima, Keiichi Katayama 2001-11-20
6320220 Quantum tunneling effect device and semiconductor composite substrate Hiroshi Watanabe, Akira Toriumi, Tomoharu Tanaka, Toru Tanzawa 2001-11-20
6288155 Thermal stabilizer and thermally stabilized halogen-containing resin composition Yasuyoshi Miyachi, Yasunori Atarashi, Takeo Tanaka 2001-09-11
6180320 Method of manufacturing a semiconductor device having a fine pattern, and semiconductor device manufactured thereby Takayuki Saito, Takeo Ishibashi, Toshiyuki Toyoshima, Kanji Sugino, Tadashi Miyagi 2001-01-30
6147148 Thermal-aging resistant thermoplastic resin composition comprising a dibasic acid erythritol ester, and resin molded article obtained therefrom Hiroyuki Tanaka 2000-11-14
6111288 Quantum tunneling effect device and semiconductor composite substrate Hiroshi Watanabe, Akira Toriumi, Tomoharu Tanaka, Toru Tanzawa 2000-08-29
6060403 Method of manufacturing semiconductor device Masahiro Koike, Kouichi Muraoka, Hideki Satake 2000-05-09
5851842 Measurement system and measurement method Ryota Katsumata, Nobuo Hayasaka, Hideshi Miyajima, Iwao Higashikawa, Masaki Hotta 1998-12-22
5586006 Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together Kiyotaka Seyama, Shunichi Kikuchi, Makoto Sumiyoshi, Minoru Hirano, Hitoshi Nori 1996-12-17